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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Convert From (Adapter End) Convert To (Adapter End) Number of Pins Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance Board Material
C9128-00 Aries Electronics C9128-00 -
RFQ
ECAD 5351 0.00000000 Aries Electronics Edge-Grip™, C91 Bulk Obsolete -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame Wire Wrap download ROHS3 Compliant Not Applicable REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 28 (2 x 14) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.675" (17.15mm) -
14-3513-11H Aries Electronics 14-3513-11H 4.2016
RFQ
ECAD 4888 0.00000000 Aries Electronics Lo-PRO®file, 513 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame 14-3513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 25 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
281-PRS19012-12 Aries Electronics 281-PRS19012-12 131.8650
RFQ
ECAD 5163 0.00000000 Aries Electronics PRS Bulk Active -65°C ~ 125°C Through Hole PGA, ZIF (ZIP) Closed Frame 281-PRS Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
17-7750-10 Aries Electronics 17-7750-10 11.6353
RFQ
ECAD 9799 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 17-7750 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 17 (1 x 17) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
32-653000-10 Aries Electronics 32-653000-10 45.6900
RFQ
ECAD 12 0.00000000 Aries Electronics Correct-A-Chip® 653000 Bulk Active - Through Hole Socket Included 32-6530 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 15 1 A - UL94 V-0 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) PLCC DIP, 0.6" (15.24mm) Row Spacing 32 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
07-0508-30 Aries Electronics 07-0508-30 2.7068
RFQ
ECAD 6043 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 105°C Through Hole SIP - 07-0508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 7 (1 x 7) Beryllium Copper - Brass 0.500" (12.70mm) -
18-351000-10 Aries Electronics 18-351000-10 21.0743
RFQ
ECAD 9022 0.00000000 Aries Electronics Correct-A-Chip® 351000 Bulk Active - Through Hole - 18-3510 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 21 - - 0.026" (0.65mm) - - Tin-Lead 200.0µin (5.08µm) SSOP DIP, 0.3" (7.62mm) Row Spacing 18 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
36-3573-10 Aries Electronics 36-3573-10 16.1088
RFQ
ECAD 6937 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 36-3573 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 36 (2 x 18) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
05-0501-30 Aries Electronics 05-0501-30 6.6458
RFQ
ECAD 3512 0.00000000 Aries Electronics 501 Bulk Active -55°C ~ 105°C Through Hole SIP - 05-0501 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 5 (1 x 5) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.690" (17.52mm) -
04-0508-20 Aries Electronics 04-0508-20 1.5352
RFQ
ECAD 6577 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 105°C Through Hole SIP - 04-0508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 4 (1 x 4) Beryllium Copper - Brass 0.360" (9.14mm) -
20-7625-10 Aries Electronics 20-7625-10 11.5988
RFQ
ECAD 1853 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 20-7625 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 20 (1 x 20) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
08-4513-10H Aries Electronics 08-4513-10H 2.2826
RFQ
ECAD 6078 0.00000000 Aries Electronics Lo-PRO®file, 513 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.4" (10.16mm) Row Spacing Closed Frame 08-4513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
30-7437-10 Aries Electronics 30-7437-10 15.3841
RFQ
ECAD 9274 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 30-7437 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 30 (1 x 30) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
10-2820-90T Aries Electronics 10-2820-90T 8.3900
RFQ
ECAD 34 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active - Through Hole, Right Angle, Horizontal DIP, 0.2" (5.08mm) Row Spacing Closed Frame 10-2820 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 10 (2 x 5) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.145" (3.68mm) -
34-0511-10 Aries Electronics 34-0511-10 6.7165
RFQ
ECAD 4838 0.00000000 Aries Electronics 511 Bulk Active -55°C ~ 105°C Through Hole SIP - 34-0511 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 5 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 50.0µin (1.27µm) Tin 50.0µin (1.27µm) 34 (1 x 34) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
28-C182-10 Aries Electronics 28-C182-10 7.4200
RFQ
ECAD 1 0.00000000 Aries Electronics EJECT-A-DIP™ Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 28-C182 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
1110267-N Aries Electronics 1110267-N 114.9875
RFQ
ECAD 7767 0.00000000 Aries Electronics Correct-A-Chip® 1110267-N Bulk Active - Through Hole - 1110267 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - - - - Tin-Lead 200.0µin (5.08µm) PLCC DIP, 0.9" (22.86mm) Row Spacing 68 - 0.100" (2.54mm) Brass - FR4 Epoxy Glass
36-3575-18 Aries Electronics 36-3575-18 149.3800
RFQ
ECAD 5516 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 36-3575 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 36 (2 x 18) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
04-1518-10T Aries Electronics 04-1518-10T 0.4949
RFQ
ECAD 6718 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.2" (5.08mm) Row Spacing Open Frame 04-1518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 4 (2 x 2) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
20-35W000-10 Aries Electronics 20-35W000-10 16.0113
RFQ
ECAD 3908 0.00000000 Aries Electronics Correct-A-Chip® 35W000 Bulk Active - Through Hole - 20-35W0 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 19 - - 0.050" (1.27mm) - - Tin-Lead - SOIC-W DIP, 0.3" (7.62mm) Row Spacing 20 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
40-C182-30 Aries Electronics 40-C182-30 24.9194
RFQ
ECAD 8132 0.00000000 Aries Electronics EJECT-A-DIP™ Bulk Active -55°C ~ 105°C Surface Mount DIP, 0.6" (15.24mm) Row Spacing Closed Frame 40-C182 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Brass 0.040" (1.02mm) -
20-8330-310C Aries Electronics 20-8330-310C 12.7829
RFQ
ECAD 2377 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame, Elevated 20-8330 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
44-6575-10 Aries Electronics 44-6575-10 20.1743
RFQ
ECAD 8727 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 44-6575 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
LCQT-QFP0.5-40-1 Aries Electronics LCQT-QFP0.5-40-1 9.9080
RFQ
ECAD 1766 0.00000000 Aries Electronics Correct-A-Chip® Tube Active -55°C ~ 125°C Through Hole - LCQT-QF Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected A868AR EAR99 8536.69.4040 17 Polyester UL94 V-0 0.020" (0.50mm) - - Gold Flash Multiple Packages QFP 40 - 0.100" (2.54mm) Brass 0.236" (6.00mm) FR4 Epoxy Glass
10-8630-310C Aries Electronics 10-8630-310C 7.3114
RFQ
ECAD 9943 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame, Elevated 10-8630 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 10 (2 x 5) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
25-0508-21 Aries Electronics 25-0508-21 17.1612
RFQ
ECAD 1489 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 125°C Through Hole SIP - 25-0508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 25 (1 x 25) Beryllium Copper - Brass 0.360" (9.14mm) -
14-354W00-10 Aries Electronics 14-354W00-10 -
RFQ
ECAD 7044 0.00000000 Aries Electronics Correct-A-Chip® 354W00 Tube Active 105°C Through Hole - 14-354W Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) DIP, 0.3" (7.62mm) Row Spacing SOWIC 14 Beryllium Copper 0.050" (1.27mm) Brass -
24-3508-201 Aries Electronics 24-3508-201 11.4535
RFQ
ECAD 8474 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 24-3508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass 0.360" (9.14mm) -
36-3513-11H Aries Electronics 36-3513-11H 14.9136
RFQ
ECAD 4781 0.00000000 Aries Electronics Lo-PRO®file, 513 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame 36-3513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 12 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 36 (2 x 18) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
32-652000-10 Aries Electronics 32-652000-10 30.2367
RFQ
ECAD 6433 0.00000000 Aries Electronics Correct-A-Chip® 652000 Bulk Active - Through Hole - 32-6520 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected Q2805019 EAR99 8536.69.4040 15 1 A - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) PLCC DIP, 0.6" (15.24mm) Row Spacing 32 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse