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Sockets for ICs, Transistors(4545)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Type | Features | Base Product Number | Termination | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Current Rating (Amps) | Housing Material | Material Flammability Rating | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Convert From (Adapter End) | Convert To (Adapter End) | Number of Pins | Number of Positions or Pins (Grid) | Contact Material - Mating | Pitch - Post | Contact Material - Post | Termination Post Length | Contact Resistance | Board Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
16-81000-310C | 10.0717 |  |
5633 | 0.00000000 | Aries Electronics | 8 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.3" (7.62mm) Row Spacing | Closed Frame, Elevated | 16-810 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10.0µin (0.25µm) | 16 (2 x 8) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.140" (3.56mm) | - | ||||||
 |
10-2810-90 | 9.8500 | |
884 | 0.00000000 | Aries Electronics | Vertisockets™ 800 | Bulk | Active | - | Through Hole, Right Angle, Vertical | DIP, 0.2" (5.08mm) Row Spacing | Closed Frame | 10-2810 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1.5 A | Polyamide (PA46), Nylon 4/6 | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | 10 (2 x 5) | Phosphor Bronze | 0.100" (2.54mm) | Phosphor Bronze | 0.145" (3.68mm) | - | ||||||
|
28-0508-31 | 18.0474 | |
5431 | 0.00000000 | Aries Electronics | 508 | Bulk | Active | -55°C ~ 125°C | Through Hole | SIP | - | 28-0508 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6 | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | 28 (1 x 28) | Beryllium Copper | - | Brass | 0.500" (12.70mm) | - | ||||||
|
24-8500-310C | 14.1819 | |
1318 | 0.00000000 | Aries Electronics | 8 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.3" (7.62mm) Row Spacing | Closed Frame, Elevated | 24-8500 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10.0µin (0.25µm) | 24 (2 x 12) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.140" (3.56mm) | - | ||||||
|
16-6501-21 | 9.9262 | |
4711 | 0.00000000 | Aries Electronics | 501 | Bulk | Active | -55°C ~ 125°C | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Closed Frame | 16-650 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 22 | 1.5 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | 16 (2 x 8) | Phosphor Bronze | 0.100" (2.54mm) | Phosphor Bronze | 0.410" (10.41mm) | - | ||||||
|
20-8950-610C | 13.0668 | |
6477 | 0.00000000 | Aries Electronics | 8 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Closed Frame, Elevated | 20-8950 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10.0µin (0.25µm) | 20 (2 x 10) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.140" (3.56mm) | - | ||||||
|
06-2503-30 | 3.0300 | |
3266 | 0.00000000 | Aries Electronics | 503 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.2" (5.08mm) Row Spacing | Closed Frame | 06-2503 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | 6 (2 x 3) | Beryllium Copper | 0.100" (2.54mm) | Phosphor Bronze | 0.500" (12.70mm) | - | ||||||
|
24-6518-112 | 7.1963 | |
8324 | 0.00000000 | Aries Electronics | 518 | Bulk | Active | - | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Open Frame | 24-6518 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | 24 (2 x 12) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - | ||||||
|
97-68340-P | - | |
8555 | 0.00000000 | Aries Electronics | Correct-A-Chip® 68340 | Bulk | Discontinued at SIC | 105°C | Through Hole | - | 97-6834 | Solder | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | Q1572280 | EAR99 | 8536.69.4040 | 30 | - | - | 0.026" (0.65mm) | Tin | - | Tin | 200.0µin (5.08µm) | QFP | PGA | 144 | Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | FR4 Epoxy Glass | |||||
|
24-354000-21-RC | 28.6007 | |
2305 | 0.00000000 | Aries Electronics | Correct-A-Chip® 354000 | Bulk | Active | - | Surface Mount | - | 24-3540 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | DIP, 0.3" (7.62mm) Row Spacing | SOIC | 24 | Beryllium Copper | 0.050" (1.27mm) | Brass | 0.089" (2.28mm) | - | |||||
|
06-7360-10 | 8.4052 | |
3077 | 0.00000000 | Aries Electronics | 700 Elevator Strip-Line™ | Bulk | Active | -55°C ~ 105°C | Through Hole | SIP | Elevated | 06-7360 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1.5 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 6 (1 x 6) | Phosphor Bronze | 0.100" (2.54mm) | Phosphor Bronze | 0.150" (3.81mm) | - | ||||||
|
48-3552-11 | 28.5517 | |
2851 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 48-3552 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 6 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | - | Gold | - | 48 (2 x 24) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | ||||||
|
24-6508-301 | 11.4535 | |
9116 | 0.00000000 | Aries Electronics | 508 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Open Frame | 24-650 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 200.0µin (5.08µm) | 24 (2 x 12) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.360" (9.14mm) | - | ||||||
|
28-0508-21 | 18.0474 | |
6329 | 0.00000000 | Aries Electronics | 508 | Bulk | Active | -55°C ~ 125°C | Through Hole | SIP | - | 28-0508 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6 | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | 28 (1 x 28) | Beryllium Copper | - | Brass | 0.360" (9.14mm) | - | ||||||
|
08-7625-10 | 6.4479 | |
1017 | 0.00000000 | Aries Electronics | 700 Elevator Strip-Line™ | Bulk | Active | -55°C ~ 105°C | Through Hole | SIP | Elevated | 08-7625 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 30 | 1.5 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 8 (1 x 8) | Phosphor Bronze | 0.100" (2.54mm) | Phosphor Bronze | 0.150" (3.81mm) | - | ||||||
 |
18-3518-10 | 1.9900 | |
631 | 0.00000000 | Aries Electronics | 518 | Bulk | Active | - | Through Hole | DIP, 0.3" (7.62mm) Row Spacing | Open Frame | 18-3518 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 21 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | 18 (2 x 9) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - | ||||||
|
24-C182-31 | 20.3871 | |
2571 | 0.00000000 | Aries Electronics | EJECT-A-DIP™ | Bulk | Active | -55°C ~ 125°C | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Closed Frame | 24-C182 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | 24 (2 x 12) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.040" (1.02mm) | - | ||||||
|
12-8473-310C | 10.2200 | |
165 | 0.00000000 | Aries Electronics | 8 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.3" (7.62mm) Row Spacing | Closed Frame, Elevated | 12-8473 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10.0µin (0.25µm) | 12 (2 x 6) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.140" (3.56mm) | - | ||||||
|
96-100M65 | - | |
6785 | 0.00000000 | Aries Electronics | - | Obsolete | - | Through Hole | - | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | - | - | 0.026" (0.65mm) | Tin | - | Tin-Lead | 200.0µin (5.08µm) | QFP | PGA | 100 | Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | FR4 Epoxy Glass | ||||||||
|
24-651000-10 | 32.8877 | |
3712 | 0.00000000 | Aries Electronics | Correct-A-Chip® 651000 | Bulk | Active | - | Through Hole | - | 24-6510 | Solder | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | - | - | 0.026" (0.65mm) | - | - | Tin-Lead | 200.0µin (5.08µm) | SSOP | DIP, 0.6" (15.24mm) Row Spacing | 24 | - | 0.100" (2.54mm) | Brass | 0.145" (3.68mm) | FR4 Epoxy Glass | |||||
|
38-0518-10T | 3.7976 | |
4246 | 0.00000000 | Aries Electronics | 518 | Bulk | Active | - | Through Hole | SIP | Open Frame | 38-0518 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | 38 (1 x 38) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - | ||||||
|
10-6503-30 | 5.2197 | |
7709 | 0.00000000 | Aries Electronics | 503 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Closed Frame | 10-650 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | 10 (2 x 5) | Beryllium Copper | 0.100" (2.54mm) | Phosphor Bronze | 0.500" (12.70mm) | - | ||||||
|
32-0511-10 | 7.6568 | |
7769 | 0.00000000 | Aries Electronics | 511 | Bulk | Active | -55°C ~ 105°C | Through Hole | SIP | - | 32-0511 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 50.0µin (1.27µm) | Tin | 50.0µin (1.27µm) | 32 (1 x 32) | Phosphor Bronze | 0.100" (2.54mm) | Phosphor Bronze | 0.150" (3.81mm) | - | ||||||
|
32-C212-31 | 25.6881 | |
5373 | 0.00000000 | Aries Electronics | EJECT-A-DIP™ | Bulk | Active | -55°C ~ 125°C | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Closed Frame | 32-C212 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | 32 (2 x 16) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.040" (1.02mm) | - | ||||||
|
12-8510-310C | 8.4437 | |
4501 | 0.00000000 | Aries Electronics | 8 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.3" (7.62mm) Row Spacing | Closed Frame, Elevated | 12-8510 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10.0µin (0.25µm) | 12 (2 x 6) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.140" (3.56mm) | - | ||||||
|
26-1518-00 | 5.4692 | |
8811 | 0.00000000 | Aries Electronics | 518 | Bulk | Active | - | Through Hole | DIP, 0.2" (5.08mm) Row Spacing | Open Frame | 26-1518 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | 26 (2 x 13) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - | ||||||
|
28-0501-21 | 17.1439 | |
6029 | 0.00000000 | Aries Electronics | 501 | Bulk | Active | -55°C ~ 125°C | Through Hole | SIP | - | 28-0501 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | 28 (1 x 28) | Phosphor Bronze | 0.100" (2.54mm) | Phosphor Bronze | 0.420" (10.67mm) | - | ||||||
|
11-0517-90C | 3.7572 | |
3141 | 0.00000000 | Aries Electronics | 0517 | Bulk | Active | - | Through Hole, Right Angle | SIP | - | 11-0517 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | - | Gold | 30.0µin (0.76µm) | Tin | 200.0µin (5.08µm) | 11 (1 x 11) | Beryllium Copper | - | Brass | 0.125" (3.18mm) | - | ||||||
|
85-PGM11007-10 | 14.1653 | |
9311 | 0.00000000 | Aries Electronics | PGM | Bulk | Active | -55°C ~ 105°C | Through Hole | PGA | - | 85-PGM1 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | - | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.165" (4.19mm) | - | ||||||
|
32-6556-11 | 15.6804 | |
4191 | 0.00000000 | Aries Electronics | 6556 | Bulk | Active | - | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Open Frame | 32-6556 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10.0µin (0.25µm) | 32 (2 x 16) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.130" (3.30mm) | - |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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