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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Convert From (Adapter End) Convert To (Adapter End) Number of Pins Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance Board Material
12-665000-00 Aries Electronics 12-665000-00 -
RFQ
ECAD 9343 0.00000000 Aries Electronics Correct-A-Chip® 665000 Bulk Active - Surface Mount - 12-6650 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) SOIC-W SOIC 12 - 0.050" (1.27mm) Brass 0.031" (0.80mm) FR4 Epoxy Glass
18-665000-00 Aries Electronics 18-665000-00 15.8116
RFQ
ECAD 1432 0.00000000 Aries Electronics Correct-A-Chip® 665000 Bulk Active - Surface Mount - 18-6650 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) SOIC-W SOIC 18 - 0.050" (1.27mm) Brass 0.031" (0.80mm) FR4 Epoxy Glass
28-665000-00 Aries Electronics 28-665000-00 17.2292
RFQ
ECAD 9413 0.00000000 Aries Electronics Correct-A-Chip® 665000 Bulk Active - Surface Mount - 28-6650 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) SOIC-W SOIC 28 - 0.050" (1.27mm) Brass 0.031" (0.80mm) FR4 Epoxy Glass
1109800-28 Aries Electronics 1109800-28 -
RFQ
ECAD 2261 0.00000000 Aries Electronics Correct-A-Chip® 1109800 Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Programmable 1109800 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
1109800-10 Aries Electronics 1109800-10 -
RFQ
ECAD 1535 0.00000000 Aries Electronics Correct-A-Chip® 1109800 Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Programmable 1109800 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 10 (2 x 5) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
1109800-12 Aries Electronics 1109800-12 -
RFQ
ECAD 2301 0.00000000 Aries Electronics Correct-A-Chip® 1109800 Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Programmable 1109800 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 12 (2 x 6) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
1111841-8 Aries Electronics 1111841-8 9.3263
RFQ
ECAD 8095 0.00000000 Aries Electronics Correct-A-Chip® 1111841 Bulk Active - Through Hole - 1111841 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.020" (0.50mm) - - Tin-Lead 200.0µin (5.08µm) MSOP DIP, 0.3" (7.62mm) Row Spacing 8 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
1111903 Aries Electronics 1111903 -
RFQ
ECAD 8590 0.00000000 Aries Electronics Correct-A-Chip® 1111903 Bulk Active - Through Hole - 1111903 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) SOWIC DIP, 0.4" (10.16mm) Row Spacing 24 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
20-301550-10 Aries Electronics 20-301550-10 16.6559
RFQ
ECAD 5320 0.00000000 Aries Electronics Correct-A-Chip® 301550 Bulk Active - Through Hole - 20-3015 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) SOIC PLCC 20 - 0.100" (2.54mm) Brass 0.030" (0.76mm) FR4 Epoxy Glass
20-301550-20 Aries Electronics 20-301550-20 16.6559
RFQ
ECAD 4166 0.00000000 Aries Electronics Correct-A-Chip® 301550 Bulk Active - Through Hole - 20-3015 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) SOIC PLCC 20 - 0.100" (2.54mm) Brass 0.090" (2.29mm) FR4 Epoxy Glass
7131-108-18 Aries Electronics 7131-108-18 -
RFQ
ECAD 1718 0.00000000 Aries Electronics - Bulk Active - Through Hole - 7131-10 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - - - - Tin-Lead 200.0µin (5.08µm) HB2E Relay DIP, 0.3" (7.62mm) Row Spacing 8 - - Brass 0.125" (3.18mm) FR4 Epoxy Glass
14-35W000-11-RC Aries Electronics 14-35W000-11-RC -
RFQ
ECAD 2907 0.00000000 Aries Electronics Correct-A-Chip® 35W000 Bulk Active - Through Hole - 14-35W0 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 27 - - 0.050" (1.27mm) - - Gold 10.0µin (0.25µm) SOIC-W DIP, 0.3" (7.62mm) Row Spacing 14 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
18-35W000-11-RC Aries Electronics 18-35W000-11-RC 22.3833
RFQ
ECAD 1533 0.00000000 Aries Electronics Correct-A-Chip® 35W000 Bulk Active - Through Hole - 18-35W0 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 21 - - 0.050" (1.27mm) - - Gold 10.0µin (0.25µm) SOIC-W DIP, 0.3" (7.62mm) Row Spacing 18 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
16-354000-11-RC Aries Electronics 16-354000-11-RC 18.2038
RFQ
ECAD 4813 0.00000000 Aries Electronics Correct-A-Chip® 354000 Bulk Active - Surface Mount - 16-3540 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) DIP, 0.3" (7.62mm) Row Spacing SOIC 16 Beryllium Copper 0.050" (1.27mm) Brass 0.030" (0.76mm) -
20-354000-11-RC Aries Electronics 20-354000-11-RC 25.6063
RFQ
ECAD 7210 0.00000000 Aries Electronics Correct-A-Chip® 354000 Bulk Active - Surface Mount - 20-3540 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) DIP, 0.3" (7.62mm) Row Spacing SOIC 20 Beryllium Copper 0.050" (1.27mm) Brass 0.030" (0.76mm) -
20-354000-21-RC Aries Electronics 20-354000-21-RC 25.6063
RFQ
ECAD 5084 0.00000000 Aries Electronics Correct-A-Chip® 354000 Bulk Active - Surface Mount - 20-3540 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) DIP, 0.3" (7.62mm) Row Spacing SOIC 20 Beryllium Copper 0.050" (1.27mm) Brass 0.089" (2.28mm) -
24-354000-21-RC Aries Electronics 24-354000-21-RC 28.6007
RFQ
ECAD 2305 0.00000000 Aries Electronics Correct-A-Chip® 354000 Bulk Active - Surface Mount - 24-3540 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) DIP, 0.3" (7.62mm) Row Spacing SOIC 24 Beryllium Copper 0.050" (1.27mm) Brass 0.089" (2.28mm) -
28-350002-11-RC-P Aries Electronics 28-350002-11-RC-P -
RFQ
ECAD 5357 0.00000000 Aries Electronics Correct-A-Chip® 350000 Bulk Discontinued at SIC - Through Hole - 28-3500 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 154 - - 0.050" (1.27mm) - - Gold 10.0µin (0.25µm) SOIC DIP, 0.3" (7.62mm) Row Spacing 28 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
1109681-628 Aries Electronics 1109681-628 -
RFQ
ECAD 7017 0.00000000 Aries Electronics - Bulk Active - Through Hole DIP, 0.6" (15.24mm) Row Spacing Spacer 1109681 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 28 (2 x 14) Brass 0.100" (2.54mm) Brass 0.125" (3.18mm) -
1109681-648 Aries Electronics 1109681-648 -
RFQ
ECAD 8009 0.00000000 Aries Electronics - Bulk Active - Through Hole DIP, 0.6" (15.24mm) Row Spacing Spacer 1109681 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 48 (2 x 24) Brass 0.100" (2.54mm) Brass 0.125" (3.18mm) -
LCQT-QFP0.5-52 Aries Electronics LCQT-QFP0.5-52 9.9080
RFQ
ECAD 2982 0.00000000 Aries Electronics Correct-A-Chip® Tube Active -55°C ~ 125°C Through Hole - LCQT-QF Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected A870AR EAR99 8536.69.4040 17 Polyester UL94 V-0 0.020" (0.50mm) - - Gold Flash Multiple Packages QFP 52 - 0.100" (2.54mm) Brass 0.236" (6.00mm) FR4 Epoxy Glass
LCQT-QFP0.65-80 Aries Electronics LCQT-QFP0.65-80 9.9080
RFQ
ECAD 8040 0.00000000 Aries Electronics Correct-A-Chip® Tube Active -55°C ~ 125°C Through Hole - LCQT-QF Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected A877AR EAR99 8536.69.4040 17 Polyester UL94 V-0 0.026" (0.65mm) - - Gold Flash Multiple Packages QFP 80 - 0.100" (2.54mm) Brass 0.236" (6.00mm) FR4 Epoxy Glass
28-3554-10 Aries Electronics 28-3554-10 12.4533
RFQ
ECAD 4217 0.00000000 Aries Electronics 55 Bulk Active -65°C ~ 105°C Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 28-3554 Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected Q6708658 EAR99 8536.69.4040 9 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
40-6501-30 Aries Electronics 40-6501-30 9.9263
RFQ
ECAD 6263 0.00000000 Aries Electronics 501 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 40-650 Wire Wrap - ROHS3 Compliant 1 (Unlimited) REACH Unaffected Q6774564 EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 40 (2 x 20) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.690" (17.52mm) -
24-650000-11-RC-P Aries Electronics 24-650000-11-RC-P -
RFQ
ECAD 3615 0.00000000 Aries Electronics Correct-A-Chip® 650000 Bulk Discontinued at SIC - Through Hole - 24-650 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 98 - - 0.050" (1.27mm) Gold - Gold 10.0µin (0.25µm) SOIC DIP, 0.6" (15.24mm) Row Spacing 24 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
28-650000-11-RC-P Aries Electronics 28-650000-11-RC-P -
RFQ
ECAD 8101 0.00000000 Aries Electronics Correct-A-Chip® 650000 Bulk Discontinued at SIC - Through Hole - 28-650 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 84 - - 0.050" (1.27mm) Gold - Gold 10.0µin (0.25µm) SOIC DIP, 0.6" (15.24mm) Row Spacing 28 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
24-6551-16 Aries Electronics 24-6551-16 44.6840
RFQ
ECAD 6043 0.00000000 Aries Electronics 55 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 24-655 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 10 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
24-6551-11 Aries Electronics 24-6551-11 16.2813
RFQ
ECAD 1476 0.00000000 Aries Electronics 55 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 24-655 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 10 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold - Gold - 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
1109253 Aries Electronics 1109253 -
RFQ
ECAD 3124 0.00000000 Aries Electronics - - Active - - - - - - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 10 - - - - - - - - - - - - -
44-3554-16 Aries Electronics 44-3554-16 78.9129
RFQ
ECAD 8778 0.00000000 Aries Electronics 55 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 44-3554 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 7 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse