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Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Type | Features | Base Product Number | Termination | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Current Rating (Amps) | Housing Material | Material Flammability Rating | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Convert From (Adapter End) | Convert To (Adapter End) | Number of Pins | Number of Positions or Pins (Grid) | Contact Material - Mating | Pitch - Post | Contact Material - Post | Termination Post Length | Contact Resistance | Board Material |
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12-665000-00 | - | 9343 | 0.00000000 | Aries Electronics | Correct-A-Chip® 665000 | Bulk | Active | - | Surface Mount | - | 12-6650 | Solder | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | - | - | 0.050" (1.27mm) | - | - | Tin-Lead | 200.0µin (5.08µm) | SOIC-W | SOIC | 12 | - | 0.050" (1.27mm) | Brass | 0.031" (0.80mm) | FR4 Epoxy Glass | ||||||||
18-665000-00 | 15.8116 | 1432 | 0.00000000 | Aries Electronics | Correct-A-Chip® 665000 | Bulk | Active | - | Surface Mount | - | 18-6650 | Solder | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | - | - | 0.050" (1.27mm) | - | - | Tin-Lead | 200.0µin (5.08µm) | SOIC-W | SOIC | 18 | - | 0.050" (1.27mm) | Brass | 0.031" (0.80mm) | FR4 Epoxy Glass | ||||||||
28-665000-00 | 17.2292 | 9413 | 0.00000000 | Aries Electronics | Correct-A-Chip® 665000 | Bulk | Active | - | Surface Mount | - | 28-6650 | Solder | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | - | - | 0.050" (1.27mm) | - | - | Tin-Lead | 200.0µin (5.08µm) | SOIC-W | SOIC | 28 | - | 0.050" (1.27mm) | Brass | 0.031" (0.80mm) | FR4 Epoxy Glass | ||||||||
1109800-28 | - | 2261 | 0.00000000 | Aries Electronics | Correct-A-Chip® 1109800 | Bulk | Active | - | Through Hole | DIP, 0.3" (7.62mm) Row Spacing | Programmable | 1109800 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 200.0µin (5.08µm) | 28 (2 x 14) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - | ||||||||
1109800-10 | - | 1535 | 0.00000000 | Aries Electronics | Correct-A-Chip® 1109800 | Bulk | Active | - | Through Hole | DIP, 0.3" (7.62mm) Row Spacing | Programmable | 1109800 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 200.0µin (5.08µm) | 10 (2 x 5) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - | ||||||||
1109800-12 | - | 2301 | 0.00000000 | Aries Electronics | Correct-A-Chip® 1109800 | Bulk | Active | - | Through Hole | DIP, 0.3" (7.62mm) Row Spacing | Programmable | 1109800 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 200.0µin (5.08µm) | 12 (2 x 6) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - | ||||||||
1111841-8 | 9.3263 | 8095 | 0.00000000 | Aries Electronics | Correct-A-Chip® 1111841 | Bulk | Active | - | Through Hole | - | 1111841 | Solder | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | - | - | 0.020" (0.50mm) | - | - | Tin-Lead | 200.0µin (5.08µm) | MSOP | DIP, 0.3" (7.62mm) Row Spacing | 8 | - | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | FR4 Epoxy Glass | ||||||||
1111903 | - | 8590 | 0.00000000 | Aries Electronics | Correct-A-Chip® 1111903 | Bulk | Active | - | Through Hole | - | 1111903 | Solder | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | - | - | 0.050" (1.27mm) | - | - | Tin-Lead | 200.0µin (5.08µm) | SOWIC | DIP, 0.4" (10.16mm) Row Spacing | 24 | - | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | FR4 Epoxy Glass | ||||||||
20-301550-10 | 16.6559 | 5320 | 0.00000000 | Aries Electronics | Correct-A-Chip® 301550 | Bulk | Active | - | Through Hole | - | 20-3015 | Solder | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | - | - | 0.050" (1.27mm) | - | - | Tin-Lead | 200.0µin (5.08µm) | SOIC | PLCC | 20 | - | 0.100" (2.54mm) | Brass | 0.030" (0.76mm) | FR4 Epoxy Glass | ||||||||
20-301550-20 | 16.6559 | 4166 | 0.00000000 | Aries Electronics | Correct-A-Chip® 301550 | Bulk | Active | - | Through Hole | - | 20-3015 | Solder | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | - | - | 0.050" (1.27mm) | - | - | Tin-Lead | 200.0µin (5.08µm) | SOIC | PLCC | 20 | - | 0.100" (2.54mm) | Brass | 0.090" (2.29mm) | FR4 Epoxy Glass | ||||||||
7131-108-18 | - | 1718 | 0.00000000 | Aries Electronics | - | Bulk | Active | - | Through Hole | - | 7131-10 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | - | - | - | - | - | Tin-Lead | 200.0µin (5.08µm) | HB2E Relay | DIP, 0.3" (7.62mm) Row Spacing | 8 | - | - | Brass | 0.125" (3.18mm) | FR4 Epoxy Glass | ||||||||
14-35W000-11-RC | - | 2907 | 0.00000000 | Aries Electronics | Correct-A-Chip® 35W000 | Bulk | Active | - | Through Hole | - | 14-35W0 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 27 | - | - | 0.050" (1.27mm) | - | - | Gold | 10.0µin (0.25µm) | SOIC-W | DIP, 0.3" (7.62mm) Row Spacing | 14 | - | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | FR4 Epoxy Glass | ||||||||
18-35W000-11-RC | 22.3833 | 1533 | 0.00000000 | Aries Electronics | Correct-A-Chip® 35W000 | Bulk | Active | - | Through Hole | - | 18-35W0 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 21 | - | - | 0.050" (1.27mm) | - | - | Gold | 10.0µin (0.25µm) | SOIC-W | DIP, 0.3" (7.62mm) Row Spacing | 18 | - | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | FR4 Epoxy Glass | ||||||||
16-354000-11-RC | 18.2038 | 4813 | 0.00000000 | Aries Electronics | Correct-A-Chip® 354000 | Bulk | Active | - | Surface Mount | - | 16-3540 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | DIP, 0.3" (7.62mm) Row Spacing | SOIC | 16 | Beryllium Copper | 0.050" (1.27mm) | Brass | 0.030" (0.76mm) | - | |||||||
20-354000-11-RC | 25.6063 | 7210 | 0.00000000 | Aries Electronics | Correct-A-Chip® 354000 | Bulk | Active | - | Surface Mount | - | 20-3540 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | DIP, 0.3" (7.62mm) Row Spacing | SOIC | 20 | Beryllium Copper | 0.050" (1.27mm) | Brass | 0.030" (0.76mm) | - | |||||||
20-354000-21-RC | 25.6063 | 5084 | 0.00000000 | Aries Electronics | Correct-A-Chip® 354000 | Bulk | Active | - | Surface Mount | - | 20-3540 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | DIP, 0.3" (7.62mm) Row Spacing | SOIC | 20 | Beryllium Copper | 0.050" (1.27mm) | Brass | 0.089" (2.28mm) | - | |||||||
24-354000-21-RC | 28.6007 | 2305 | 0.00000000 | Aries Electronics | Correct-A-Chip® 354000 | Bulk | Active | - | Surface Mount | - | 24-3540 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | DIP, 0.3" (7.62mm) Row Spacing | SOIC | 24 | Beryllium Copper | 0.050" (1.27mm) | Brass | 0.089" (2.28mm) | - | |||||||
28-350002-11-RC-P | - | 5357 | 0.00000000 | Aries Electronics | Correct-A-Chip® 350000 | Bulk | Discontinued at SIC | - | Through Hole | - | 28-3500 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 154 | - | - | 0.050" (1.27mm) | - | - | Gold | 10.0µin (0.25µm) | SOIC | DIP, 0.3" (7.62mm) Row Spacing | 28 | - | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | FR4 Epoxy Glass | ||||||||
1109681-628 | - | 7017 | 0.00000000 | Aries Electronics | - | Bulk | Active | - | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Spacer | 1109681 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 200.0µin (5.08µm) | 28 (2 x 14) | Brass | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - | ||||||||
1109681-648 | - | 8009 | 0.00000000 | Aries Electronics | - | Bulk | Active | - | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Spacer | 1109681 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 200.0µin (5.08µm) | 48 (2 x 24) | Brass | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - | ||||||||
LCQT-QFP0.5-52 | 9.9080 | 2982 | 0.00000000 | Aries Electronics | Correct-A-Chip® | Tube | Active | -55°C ~ 125°C | Through Hole | - | LCQT-QF | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | A870AR | EAR99 | 8536.69.4040 | 17 | Polyester | UL94 V-0 | 0.020" (0.50mm) | - | - | Gold | Flash | Multiple Packages | QFP | 52 | - | 0.100" (2.54mm) | Brass | 0.236" (6.00mm) | FR4 Epoxy Glass | |||||||
LCQT-QFP0.65-80 | 9.9080 | 8040 | 0.00000000 | Aries Electronics | Correct-A-Chip® | Tube | Active | -55°C ~ 125°C | Through Hole | - | LCQT-QF | Solder | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | A877AR | EAR99 | 8536.69.4040 | 17 | Polyester | UL94 V-0 | 0.026" (0.65mm) | - | - | Gold | Flash | Multiple Packages | QFP | 80 | - | 0.100" (2.54mm) | Brass | 0.236" (6.00mm) | FR4 Epoxy Glass | |||||||
28-3554-10 | 12.4533 | 4217 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | -65°C ~ 105°C | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 28-3554 | Solder | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | Q6708658 | EAR99 | 8536.69.4040 | 9 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 28 (2 x 14) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |||||||
40-6501-30 | 9.9263 | 6263 | 0.00000000 | Aries Electronics | 501 | Bulk | Active | -55°C ~ 125°C | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Closed Frame | 40-650 | Wire Wrap | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | Q6774564 | EAR99 | 8536.69.4040 | 1 | 1.5 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 40 (2 x 20) | Phosphor Bronze | 0.100" (2.54mm) | Phosphor Bronze | 0.690" (17.52mm) | - | |||||||
24-650000-11-RC-P | - | 3615 | 0.00000000 | Aries Electronics | Correct-A-Chip® 650000 | Bulk | Discontinued at SIC | - | Through Hole | - | 24-650 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 98 | - | - | 0.050" (1.27mm) | Gold | - | Gold | 10.0µin (0.25µm) | SOIC | DIP, 0.6" (15.24mm) Row Spacing | 24 | - | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | FR4 Epoxy Glass | ||||||||
28-650000-11-RC-P | - | 8101 | 0.00000000 | Aries Electronics | Correct-A-Chip® 650000 | Bulk | Discontinued at SIC | - | Through Hole | - | 28-650 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 84 | - | - | 0.050" (1.27mm) | Gold | - | Gold | 10.0µin (0.25µm) | SOIC | DIP, 0.6" (15.24mm) Row Spacing | 28 | - | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | FR4 Epoxy Glass | ||||||||
24-6551-16 | 44.6840 | 6043 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 24-655 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 10 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 50.0µin (1.27µm) | 24 (2 x 12) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | ||||||||
24-6551-11 | 16.2813 | 1476 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 24-655 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 10 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | - | Gold | - | 24 (2 x 12) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | ||||||||
1109253 | - | 3124 | 0.00000000 | Aries Electronics | - | - | Active | - | - | - | - | - | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 10 | - | - | - | - | - | - | - | - | - | - | - | - | - | ||||||||||
44-3554-16 | 78.9129 | 8778 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 44-3554 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 7 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 50.0µin (1.27µm) | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - |
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