Tel: +86-0755-83501315
Email: sales@sic-components.com
Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Type | Features | Base Product Number | Termination | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | ECCN | HTSUS | Standard Package | Current Rating (Amps) | Housing Material | Material Flammability Rating | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Pitch - Post | Contact Material - Post | Termination Post Length | Contact Resistance |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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32-3553-11 | 20.4525 | ![]() |
2251 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 32-3553 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 8 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | - | Gold | - | 32 (2 x 16) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |
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32-6553-10 | 13.1180 | ![]() |
6022 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 32-6553 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 8 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | - | Gold | - | 32 (2 x 16) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |
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32-3554-11 | 20.4525 | ![]() |
5474 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 32-3554 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 8 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | - | Gold | - | 32 (2 x 16) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |
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36-3551-16 | 65.7271 | ![]() |
1516 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 36-3551 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 7 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 50.0µin (1.27µm) | 36 (2 x 18) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |
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36-3553-16 | 65.7271 | ![]() |
9064 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 36-3553 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 7 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 50.0µin (1.27µm) | 36 (2 x 18) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |
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36-6551-16 | 65.7271 | ![]() |
8161 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 36-6551 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 7 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 50.0µin (1.27µm) | 36 (2 x 18) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |
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40-6551-16 | 68.9886 | ![]() |
4187 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 40-6551 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 7 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 50.0µin (1.27µm) | 40 (2 x 20) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |
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40-6553-16 | 68.9886 | ![]() |
2924 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | -55°C ~ 250°C | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 40-6553 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 7 | 1 A | Polyetheretherketone (PEEK), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 50.0µin (1.27µm) | 40 (2 x 20) | Beryllium Nickel | 0.100" (2.54mm) | Beryllium Nickel | 0.110" (2.78mm) | - | |
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44-3552-16 | 78.9129 | ![]() |
2157 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 44-3552 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 7 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 50.0µin (1.27µm) | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |
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36-6552-10 | 14.9834 | ![]() |
9068 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 36-6552 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 7 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 36 (2 x 18) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |
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40-3551-11 | 24.3957 | ![]() |
2134 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 40-3551 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 7 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | - | Gold | - | 40 (2 x 20) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |
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40-3552-10 | 15.8718 | ![]() |
2598 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 40-3552 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 7 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 40 (2 x 20) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |
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40-6552-11 | 24.3957 | ![]() |
1852 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 40-6552 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 7 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | - | Gold | - | 40 (2 x 20) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |
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40-6553-10 | 15.8718 | ![]() |
2234 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 40-6553 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 7 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | - | Gold | - | 40 (2 x 20) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |
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40-6553-11 | 24.3957 | ![]() |
8376 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 40-6553 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 7 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 50.0µin (1.27µm) | 40 (2 x 20) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |
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42-3551-11 | 26.4081 | ![]() |
2359 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 42-3551 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 7 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | - | Gold | - | 42 (2 x 21) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |
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42-3553-10 | 17.1786 | ![]() |
1846 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 42-3553 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 7 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 42 (2 x 21) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |
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44-3553-10 | 16.1246 | ![]() |
8785 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 44-3553 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 7 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |
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44-6551-10 | 16.1246 | ![]() |
4006 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 44-6551 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 7 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |
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36-3552-16 | 65.7271 | ![]() |
8744 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 36-3552 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 7 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 50.0µin (1.27µm) | 36 (2 x 18) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |
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36-3554-16 | 65.7271 | ![]() |
5243 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 36-3554 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 7 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 50.0µin (1.27µm) | 36 (2 x 18) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |
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42-3554-16 | 75.3414 | ![]() |
1084 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 42-3554 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 7 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 50.0µin (1.27µm) | 42 (2 x 21) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |
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44-6554-16 | 78.9129 | ![]() |
9379 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 44-6554 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 7 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 50.0µin (1.27µm) | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |
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36-3554-11 | 22.9886 | ![]() |
1308 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 36-3554 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 7 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | - | Gold | - | 36 (2 x 18) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |
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36-6554-10 | 14.9834 | ![]() |
6083 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 36-6554 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 7 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 36 (2 x 18) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |
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42-6554-11 | 26.4081 | ![]() |
1218 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 42-6554 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 7 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | - | Gold | - | 42 (2 x 21) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |
![]() |
48-3551-16 | 81.4717 | ![]() |
3284 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 48-3551 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 6 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 50.0µin (1.27µm) | 48 (2 x 24) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |
![]() |
48-3552-16 | 81.4717 | ![]() |
9502 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 48-3552 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 6 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 50.0µin (1.27µm) | 48 (2 x 24) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |
![]() |
48-6551-16 | 81.4717 | ![]() |
5488 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 48-6551 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 6 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 50.0µin (1.27µm) | 48 (2 x 24) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |
![]() |
48-3551-11 | 28.5517 | ![]() |
1587 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 48-3551 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 6 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | - | Gold | - | 48 (2 x 24) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - |
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