Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance
614-93-133-14-071012 Mill-Max Manufacturing Corp. 614-93-133-14-071012 -
RFQ
ECAD 7240 0.00000000 Mill-Max Manufacturing Corp. 614 Bulk Active -55°C ~ 125°C Through Hole PGA Carrier, Open Frame 614-93 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 133 (14 x 14) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.136" (3.45mm) 10mOhm
511-13-073-11-061002 Mill-Max Manufacturing Corp. 511-13-073-11-061002 -
RFQ
ECAD 4662 0.00000000 Mill-Max Manufacturing Corp. 511 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 511-13 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 73 (11 x 11) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) 10mOhm
2900-9321-00-2431 3M 2900-9321-00-2431 -
RFQ
ECAD 6645 0.00000000 3M Textool™ Bulk Obsolete - - - - - - Not Applicable OBSOLETE 5 - - - - - - - - - - - - -
4-1814655-7 TE Connectivity AMP Connectors 4-1814655-7 -
RFQ
ECAD 8988 0.00000000 TE Connectivity AMP Connectors - Bulk Obsolete -55°C ~ 125°C Through Hole SIP Closed Frame 1814655 Solder download RoHS Compliant 1 (Unlimited) Vendor Undefined EAR99 8536.69.4040 3,500 Thermoplastic, Polyester UL94 V-0 0.100" (2.54mm) Gold Flash Tin 196.9µin (5.00µm) 5 (1 x 5) Beryllium Copper 0.100" (2.54mm) Brass 0.114" (2.90mm) 10mOhm
AR48-HZL/01-TT Assmann WSW Components AR48-HZL/01-TT -
RFQ
ECAD 2678 0.00000000 Assmann WSW Components - Bag Obsolete -40°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame AR48-HZ Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 9 3 A Thermoplastic, Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) Beryllium Copper - 4mOhm
C9122-00 Aries Electronics C9122-00 -
RFQ
ECAD 3070 0.00000000 Aries Electronics Edge-Grip™, C91 Bulk Obsolete -55°C ~ 125°C Through Hole DIP, 0.4" (10.16mm) Row Spacing Closed Frame Wire Wrap download ROHS3 Compliant Not Applicable REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 22 (2 x 11) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.675" (17.15mm) -
20-0511-10 Aries Electronics 20-0511-10 5.8800
RFQ
ECAD 2 0.00000000 Aries Electronics 511 Bulk Active -55°C ~ 105°C Through Hole SIP - 20-0511 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 10 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 50.0µin (1.27µm) Tin 50.0µin (1.27µm) 20 (1 x 20) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
228-1277-00-0602J 3M 228-1277-00-0602J 28.0000
RFQ
ECAD 50 0.00000000 3M Textool™ Tube Active -55°C ~ 125°C Connector DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 228 Press-Fit download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
BU180Z-178-HT On Shore Technology Inc. BU180Z-178-HT -
RFQ
ECAD 3814 0.00000000 On Shore Technology Inc. BU-178HT Tube Obsolete -55°C ~ 125°C Surface Mount DIP, 0.3" (7.62mm) Row Spacing Open Frame BU180Z Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 22 1 A Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 78.7µin (2.00µm) Copper Flash 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) Brass 0.059" (1.50mm) 7mOhm
116-87-422-41-018101 Preci-Dip 116-87-422-41-018101 1.6667
RFQ
ECAD 3711 0.00000000 Preci-Dip 116 Tube Active -55°C ~ 125°C Through Hole DIP, 0.4" (10.16mm) Row Spacing Elevated, Open Frame 116-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 19 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 22 (2 x 11) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
114-87-308-41-117101 Preci-Dip 114-87-308-41-117101 0.8000
RFQ
ECAD 11 0.00000000 Preci-Dip 114 Tube Active -55°C ~ 125°C Surface Mount DIP, 0.3" (7.62mm) Row Spacing Open Frame 114-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 52 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Brass 0.047" (1.20mm) 10mOhm
181-PGM18041-10 Aries Electronics 181-PGM18041-10 -
RFQ
ECAD 3315 0.00000000 Aries Electronics PGM Bulk Obsolete -55°C ~ 105°C Through Hole PGA - Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Brass 0.165" (4.19mm) -
114-83-322-41-117101 Preci-Dip 114-83-322-41-117101 1.4207
RFQ
ECAD 9711 0.00000000 Preci-Dip 114 Bulk Active -55°C ~ 125°C Surface Mount DIP, 0.3" (7.62mm) Row Spacing Open Frame 114-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 18 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 22 (2 x 11) Beryllium Copper 0.100" (2.54mm) Brass 0.047" (1.20mm) 10mOhm
NTE430 NTE Electronics, Inc NTE430 0.8400
RFQ
ECAD 580 0.00000000 NTE Electronics, Inc - Bulk Active - Through Hole - - Solder download ROHS3 Compliant 2368-NTE430 EAR99 8535.90.8040 1 - - - - - - 40 (2 x 20) - - - - -
116-91-636-41-008000 Mill-Max Manufacturing Corp. 116-91-636-41-008000 16.3015
RFQ
ECAD 8925 0.00000000 Mill-Max Manufacturing Corp. 116 Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Elevated, Open Frame 116-91 Solder download 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 11 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 36 (2 x 18) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.472" (11.99mm) 10mOhm
A-CCS 052-Z-SM Assmann WSW Components A-CCS 052-Z-SM 1.2248
RFQ
ECAD 5870 0.00000000 Assmann WSW Components - Tube Active -40°C ~ 105°C Surface Mount PLCC Closed Frame A-CCS 05 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 23 1 A Polyamide (PA9T), Nylon 9T, Glass Filled UL94 V-0 0.050" (1.27mm) Tin 160.0µin (4.06µm) Tin 160.0µin (4.06µm) 52 (4 x 13) Phosphor Bronze 0.050" (1.27mm) Phosphor Bronze - 15mOhm
NTE409 NTE Electronics, Inc NTE409 0.5600
RFQ
ECAD 525 0.00000000 NTE Electronics, Inc - Bulk Active - Through Hole - - Solder download ROHS3 Compliant 2368-NTE409 EAR99 7616.99.5060 1 - - - - - - 14 (2 x 7) - - - - -
121-PRS13106-12 Aries Electronics 121-PRS13106-12 83.4633
RFQ
ECAD 5193 0.00000000 Aries Electronics PRS Bulk Active -65°C ~ 125°C Through Hole PGA, ZIF (ZIP) Closed Frame 121-PRS Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
32-3574-11 Aries Electronics 32-3574-11 24.4610
RFQ
ECAD 4199 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 32-3574 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 10 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Nickel 0.100" (2.54mm) Beryllium Nickel 0.110" (2.78mm) -
84-PRS11032-12 Aries Electronics 84-PRS11032-12 76.9217
RFQ
ECAD 2873 0.00000000 Aries Electronics PRS Bulk Active -65°C ~ 125°C Through Hole PGA, ZIF (ZIP) Closed Frame 84-PRS1 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
181-PLS18041-12 Aries Electronics 181-PLS18041-12 114.4550
RFQ
ECAD 9995 0.00000000 Aries Electronics PLS Bulk Active -65°C ~ 125°C Through Hole PGA, ZIF (ZIP) Closed Frame 181-PLS Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
24-3573-11 Aries Electronics 24-3573-11 20.3542
RFQ
ECAD 8142 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 24-3573 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 12 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
114-87-308-41-134191 Preci-Dip 114-87-308-41-134191 0.5393
RFQ
ECAD 8386 0.00000000 Preci-Dip 114 Tape & Reel (TR) Active -55°C ~ 125°C Surface Mount DIP, 0.3" (7.62mm) Row Spacing Open Frame 114-87 Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1,000 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Brass 0.047" (1.20mm) 10mOhm
146-41-320-41-013000 Mill-Max Manufacturing Corp. 146-41-320-41-013000 13.6347
RFQ
ECAD 7545 0.00000000 Mill-Max Manufacturing Corp. 146 Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 146-41 Press-Fit download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 20 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.175" (4.45mm) 10mOhm
145-PRS15024-12 Aries Electronics 145-PRS15024-12 94.3140
RFQ
ECAD 3384 0.00000000 Aries Electronics PRS Bulk Active -65°C ~ 125°C Through Hole PGA, ZIF (ZIP) Closed Frame 145-PRS Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
36-3574-16 Aries Electronics 36-3574-16 48.8311
RFQ
ECAD 6558 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 36-3574 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 36 (2 x 18) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
16-8300-310C Aries Electronics 16-8300-310C 10.0717
RFQ
ECAD 7104 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame, Elevated 16-8300 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
40-6573-10 Aries Electronics 40-6573-10 17.0639
RFQ
ECAD 6504 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 40-6573 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 7 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
210-47-306-41-001000 Mill-Max Manufacturing Corp. 210-47-306-41-001000 11.5988
RFQ
ECAD 4415 0.00000000 Mill-Max Manufacturing Corp. 210 Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame 210-47 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 67 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold Flash Tin 200.0µin (5.08µm) 6 (2 x 3) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm
22-4501-20 Aries Electronics 22-4501-20 -
RFQ
ECAD 6808 0.00000000 Aries Electronics 501 Bulk Obsolete -55°C ~ 105°C Through Hole DIP, 0.4" (10.16mm) Row Spacing Closed Frame Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 22 (2 x 11) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.410" (10.41mm) -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse