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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance
115-83-650-41-001101 Preci-Dip 115-83-650-41-001101 3.7856
RFQ
ECAD 6355 0.00000000 Preci-Dip 115 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 115-83 Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 50 (2 x 25) Beryllium Copper 0.100" (2.54mm) Brass 0.095" (2.41mm) 10mOhm
D83084B-46 Harwin Inc. D83084B-46 -
RFQ
ECAD 9874 0.00000000 Harwin Inc. D830 Tube Obsolete -50°C ~ 105°C Surface Mount PLCC Board Guide, Closed Frame Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 16 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.050" (1.27mm) Tin - Tin - 84 (4 x 21) Phosphor Bronze 0.050" (1.27mm) Phosphor Bronze - 30mOhm
510-13-256-16-000001 Mill-Max Manufacturing Corp. 510-13-256-16-000001 59.8834
RFQ
ECAD 5915 0.00000000 Mill-Max Manufacturing Corp. 510 Bulk Active -55°C ~ 125°C Through Hole PGA Closed Frame 510-13 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 256 (16 x 16) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm
ICF-628-STL-O Samtec Inc. ICF-628-STL-O 11.2000
RFQ
ECAD 6224 0.00000000 Samtec Inc. ICF Bulk Active -55°C ~ 125°C Surface Mount DIP, 0.6" (15.24mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICF-628-STL-O 1 Liquid Crystal Polymer (LCP) - 0.100" (2.54mm) Tin - Tin - 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Beryllium Copper - -
1939737-1 TE Connectivity AMP Connectors 1939737-1 -
RFQ
ECAD 2128 0.00000000 TE Connectivity AMP Connectors - Tray Obsolete - - LGA - 1939737 - - ROHS3 Compliant 1 (Unlimited) Vendor Undefined EAR99 8536.69.4040 200 - - - - - - - 1366 (32 x 41) - - - - -
116-83-304-41-007101 Preci-Dip 116-83-304-41-007101 0.4272
RFQ
ECAD 3978 0.00000000 Preci-Dip 116 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Elevated, Open Frame 116-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 108 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 4 (2 x 2) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
510-83-101-15-101101 Preci-Dip 510-83-101-15-101101 5.8682
RFQ
ECAD 9861 0.00000000 Preci-Dip 510 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 510-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 14 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 101 (15 x 15) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
06-3518-10M Aries Electronics 06-3518-10M 1.0605
RFQ
ECAD 9016 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 06-3518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 66 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 6 (2 x 3) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
522-93-179-18-117002 Mill-Max Manufacturing Corp. 522-93-179-18-117002 -
RFQ
ECAD 4789 0.00000000 Mill-Max Manufacturing Corp. 522 Bulk Active - Through Hole PGA - 522-93 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 179 (18 x 18) - 0.100" (2.54mm) - 0.370" (9.40mm) -
126-43-650-41-003000 Mill-Max Manufacturing Corp. 126-43-650-41-003000 24.0248
RFQ
ECAD 6368 0.00000000 Mill-Max Manufacturing Corp. 126 Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 126-43 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 50 (2 x 25) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.661" (16.79mm) 10mOhm
20-81000-610C Aries Electronics 20-81000-610C 13.0668
RFQ
ECAD 2182 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame, Elevated 20-8100 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
110-87-308-41-605101 Preci-Dip 110-87-308-41-605101 0.2901
RFQ
ECAD 3195 0.00000000 Preci-Dip 110 Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 110-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 52 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
614-93-308-31-012000 Mill-Max Manufacturing Corp. 614-93-308-31-012000 2.6700
RFQ
ECAD 345 0.00000000 Mill-Max Manufacturing Corp. 614 Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Carrier, Open Frame 614-93 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 50 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.136" (3.45mm) -
115-93-648-41-003000 Mill-Max Manufacturing Corp. 115-93-648-41-003000 16.9227
RFQ
ECAD 9834 0.00000000 Mill-Max Manufacturing Corp. 115 Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 115-93 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) -
612-93-310-41-004000 Mill-Max Manufacturing Corp. 612-93-310-41-004000 12.7200
RFQ
ECAD 3670 0.00000000 Mill-Max Manufacturing Corp. 612 Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Carrier, Open Frame 612-93 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 40 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 10 (2 x 5) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.273" (6.93mm) 10mOhm
510-AG92D-20 TE Connectivity AMP Connectors 510-AG92D-20 -
RFQ
ECAD 8487 0.00000000 TE Connectivity AMP Connectors - Bulk Active - Through Hole SIP Closed Frame 510 Solder - RoHS non-compliant 1 (Unlimited) Vendor Undefined 1437531-1 EAR99 8536.69.4040 5,952 Thermoplastic UL94 V-0 0.100" (2.54mm) Tin-Lead - Tin-Lead - 20 (1 x 20) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
115-87-324-41-003101 Preci-Dip 115-87-324-41-003101 1.1119
RFQ
ECAD 8319 0.00000000 Preci-Dip 115 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 115-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 17 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass 0.095" (2.41mm) 10mOhm
110-93-952-41-001000 Mill-Max Manufacturing Corp. 110-93-952-41-001000 15.5788
RFQ
ECAD 3772 0.00000000 Mill-Max Manufacturing Corp. 110 Tube Active -55°C ~ 125°C Through Hole DIP, 0.9" (22.86mm) Row Spacing Open Frame 110-93 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 7 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 52 (2 x 26) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) -
346-93-163-41-013000 Mill-Max Manufacturing Corp. 346-93-163-41-013000 11.0300
RFQ
ECAD 1796 0.00000000 Mill-Max Manufacturing Corp. 346 Bulk Active -55°C ~ 125°C Through Hole SIP - 346-93 Press-Fit download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 63 (1 x 63) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.175" (4.45mm) -
7100148803 3M 7100148803 98.3900
RFQ
ECAD 4280 0.00000000 3M - Bulk Active - 19-7100148803 20
40-0518-10 Aries Electronics 40-0518-10 4.0400
RFQ
ECAD 2 0.00000000 Aries Electronics 518 Bulk Active - Through Hole SIP Open Frame 40-0518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 40 (1 x 40) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
BU400Z-178-HT On Shore Technology Inc. BU400Z-178-HT -
RFQ
ECAD 2040 0.00000000 On Shore Technology Inc. BU-178HT Tube Obsolete -55°C ~ 125°C Surface Mount DIP, 0.6" (15.24mm) Row Spacing Open Frame BU400Z Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 10 1 A Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 78.7µin (2.00µm) Copper Flash 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Brass 0.059" (1.50mm) 7mOhm
22-4518-10 Aries Electronics 22-4518-10 2.8800
RFQ
ECAD 225 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.4" (10.16mm) Row Spacing Open Frame 22-4518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 22 (2 x 11) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
299-87-316-10-001101 Preci-Dip 299-87-316-10-001101 2.9242
RFQ
ECAD 2291 0.00000000 Preci-Dip 299 Tube Active -55°C ~ 125°C Through Hole, Right Angle, Horizontal DIP, 0.3" (7.62mm) Row Spacing Closed Frame 299-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 26 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) Brass 0.128" (3.24mm) 10mOhm
115-83-650-41-003101 Preci-Dip 115-83-650-41-003101 4.0550
RFQ
ECAD 4953 0.00000000 Preci-Dip 115 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 115-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 50 (2 x 25) Beryllium Copper 0.100" (2.54mm) Brass 0.095" (2.41mm) 10mOhm
D01-9950542 Harwin Inc. D01-9950542 -
RFQ
ECAD 5300 0.00000000 Harwin Inc. D01-995 Tube Active -55°C ~ 125°C Through Hole SIP - D01-995 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1,000 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 196.9µin (5.00µm) 5 (1 x 5) Beryllium Copper 0.100" (2.54mm) Brass 0.510" (12.95mm) 10mOhm
116-83-318-41-007101 Preci-Dip 116-83-318-41-007101 1.9908
RFQ
ECAD 6505 0.00000000 Preci-Dip 116 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Elevated, Open Frame 116-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 23 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
110-83-642-41-105161 Preci-Dip 110-83-642-41-105161 4.2489
RFQ
ECAD 8934 0.00000000 Preci-Dip 110 Bulk Active -55°C ~ 125°C Surface Mount DIP, 0.6" (15.24mm) Row Spacing Open Frame 110-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 9 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 42 (2 x 21) Beryllium Copper 0.100" (2.54mm) Brass 0.118" (3.00mm) 10mOhm
511-13-169-13-000002 Mill-Max Manufacturing Corp. 511-13-169-13-000002 -
RFQ
ECAD 3853 0.00000000 Mill-Max Manufacturing Corp. 511 Bulk Active -55°C ~ 125°C Through Hole PGA Closed Frame 511-13 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 169 (13 x 13) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) 10mOhm
12-0501-30 Aries Electronics 12-0501-30 6.6781
RFQ
ECAD 6908 0.00000000 Aries Electronics 501 Bulk Active -55°C ~ 105°C Through Hole SIP - 12-0501 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 20 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 12 (1 x 12) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.690" (17.52mm) -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse