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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Applications Mounting Type Features Base Product Number Termination Ingress Protection Style DataSheet RoHS Status Moisture Sensitivity Level (MSL) ECCN HTSUS Standard Package Connector Type Number of Rows Current Rating (Amps) Contact Material Material Flammability Rating Contact Type Pitch - Mating Number of Positions Row Spacing - Mating Number of Positions Loaded Shrouding Fastening Type Contact Length - Mating Contact Length - Post Overall Contact Length Insulation Height Contact Shape Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Insulation Material Insulation Color Voltage Rating Mated Stacking Heights Contact Finish Thickness - Post
HMTSW-207-28-L-T-940 Samtec Inc. HMTSW-207-28-L-T-940 -
RFQ
ECAD 3604 0.00000000 Samtec Inc. Flex Stack, HMTSW Bulk Active -55°C ~ 125°C - Through Hole - HMTSW-207 Solder - Board to Board or Cable download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 3 3A Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 21 0.100" (2.54mm) All Unshrouded Push-Pull 0.940" (23.88mm) 0.090" (2.29mm) 1.130" (28.70mm) 0.100" (2.54mm) Square Gold 10.0µin (0.25µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HMTSW-207-28-S-D-940 Samtec Inc. HMTSW-207-28-S-D-940 -
RFQ
ECAD 3364 0.00000000 Samtec Inc. Flex Stack, HMTSW Bulk Active -55°C ~ 125°C - Through Hole - HMTSW-207 Solder - Board to Board or Cable download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 2 3A Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 14 0.100" (2.54mm) All Unshrouded Push-Pull 0.940" (23.88mm) 0.090" (2.29mm) 1.130" (28.70mm) 0.100" (2.54mm) Square Gold 30.0µin (0.76µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HMTSW-208-06-G-S-000 Samtec Inc. HMTSW-208-06-G-S-000 -
RFQ
ECAD 7607 0.00000000 Samtec Inc. Flex Stack, HMTSW Bulk Active -55°C ~ 125°C - Through Hole - HMTSW-208 Solder - Board to Board or Cable download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 1 3A Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 8 - All Unshrouded Push-Pull - 0.200" (5.08mm) 0.300" (7.62mm) 0.100" (2.54mm) Square Gold 10.0µin (0.25µm) Gold Liquid Crystal Polymer (LCP) Natural - - 3.00µin (0.076µm)
HMTSW-208-06-G-S-100 Samtec Inc. HMTSW-208-06-G-S-100 -
RFQ
ECAD 7924 0.00000000 Samtec Inc. Flex Stack, HMTSW Bulk Active -55°C ~ 125°C - Through Hole - HMTSW-208 Solder - Board to Board or Cable download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 1 3A Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 8 - All Unshrouded Push-Pull 0.100" (2.54mm) 0.100" (2.54mm) 0.300" (7.62mm) 0.100" (2.54mm) Square Gold 10.0µin (0.25µm) Gold Liquid Crystal Polymer (LCP) Natural - - 3.00µin (0.076µm)
HMTSW-208-07-L-D-240 Samtec Inc. HMTSW-208-07-L-D-240 -
RFQ
ECAD 8580 0.00000000 Samtec Inc. Flex Stack, HMTSW Bulk Active -55°C ~ 125°C - Through Hole - HMTSW-208 Solder - Board to Board or Cable download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 2 3A Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 16 0.100" (2.54mm) All Unshrouded Push-Pull 0.240" (6.10mm) 0.090" (2.29mm) 0.430" (10.92mm) 0.100" (2.54mm) Square Gold 10.0µin (0.25µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HMTSW-208-07-L-Q-240 Samtec Inc. HMTSW-208-07-L-Q-240 -
RFQ
ECAD 2283 0.00000000 Samtec Inc. Flex Stack, HMTSW Bulk Active -55°C ~ 125°C - Through Hole - HMTSW-208 Solder - Board to Board or Cable download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 2 3A Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 16 0.200" (5.08mm) All Unshrouded Push-Pull 0.240" (6.10mm) 0.090" (2.29mm) 0.430" (10.92mm) 0.100" (2.54mm) Square Gold 10.0µin (0.25µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HMTSW-208-07-S-D-240 Samtec Inc. HMTSW-208-07-S-D-240 -
RFQ
ECAD 8279 0.00000000 Samtec Inc. Flex Stack, HMTSW Bulk Active -55°C ~ 125°C - Through Hole - HMTSW-208 Solder - Board to Board or Cable download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 2 3A Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 16 0.100" (2.54mm) All Unshrouded Push-Pull 0.240" (6.10mm) 0.090" (2.29mm) 0.430" (10.92mm) 0.100" (2.54mm) Square Gold 30.0µin (0.76µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HMTSW-208-07-T-D-240 Samtec Inc. HMTSW-208-07-T-D-240 -
RFQ
ECAD 1363 0.00000000 Samtec Inc. Flex Stack, HMTSW Bulk Active -55°C ~ 105°C - Through Hole - HMTSW-208 Solder - Board to Board or Cable download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 2 3A Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 16 0.100" (2.54mm) All Unshrouded Push-Pull 0.240" (6.10mm) 0.090" (2.29mm) 0.430" (10.92mm) 0.100" (2.54mm) Square Tin - Tin Liquid Crystal Polymer (LCP) Natural - - -
HMTSW-208-07-T-S-007 Samtec Inc. HMTSW-208-07-T-S-007 -
RFQ
ECAD 5732 0.00000000 Samtec Inc. Flex Stack, HMTSW Bulk Active -55°C ~ 105°C - Through Hole - HMTSW-208 Solder - Board to Board or Cable download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 1 3A Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 8 - All Unshrouded Push-Pull 0.007" (0.18mm) 0.323" (8.20mm) 0.430" (10.92mm) 0.100" (2.54mm) Square Tin - Tin Liquid Crystal Polymer (LCP) Natural - - -
HMTSW-208-08-F-D-000 Samtec Inc. HMTSW-208-08-F-D-000 -
RFQ
ECAD 4967 0.00000000 Samtec Inc. Flex Stack, HMTSW Bulk Active -55°C ~ 125°C - Through Hole - HMTSW-208 Solder - Board to Board or Cable download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 2 3A Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 16 0.100" (2.54mm) All Unshrouded Push-Pull - 0.430" (10.92mm) 0.530" (13.46mm) 0.100" (2.54mm) Square Gold 3.00µin (0.076µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HMTSW-208-09-G-S-500 Samtec Inc. HMTSW-208-09-G-S-500 -
RFQ
ECAD 7536 0.00000000 Samtec Inc. Flex Stack, HMTSW Bulk Active -55°C ~ 125°C - Through Hole - HMTSW-208 Solder - Board to Board or Cable download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 1 3A Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 8 - All Unshrouded Push-Pull 0.500" (12.70mm) 0.130" (3.30mm) 0.730" (18.54mm) 0.100" (2.54mm) Square Gold 10.0µin (0.25µm) Gold Liquid Crystal Polymer (LCP) Natural - - 3.00µin (0.076µm)
HMTSW-208-09-L-S-500 Samtec Inc. HMTSW-208-09-L-S-500 -
RFQ
ECAD 1565 0.00000000 Samtec Inc. Flex Stack, HMTSW Bulk Active -55°C ~ 125°C - Through Hole - HMTSW-208 Solder - Board to Board or Cable download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 1 3A Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 8 - All Unshrouded Push-Pull 0.500" (12.70mm) 0.130" (3.30mm) 0.730" (18.54mm) 0.100" (2.54mm) Square Gold 10.0µin (0.25µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HMTSW-208-09-S-D-540 Samtec Inc. HMTSW-208-09-S-D-540 -
RFQ
ECAD 5747 0.00000000 Samtec Inc. Flex Stack, HMTSW Bulk Active -55°C ~ 125°C - Through Hole - HMTSW-208 Solder - Board to Board or Cable download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 2 3A Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 16 0.100" (2.54mm) All Unshrouded Push-Pull 0.540" (13.72mm) 0.090" (2.29mm) 0.730" (18.54mm) 0.100" (2.54mm) Square Gold 30.0µin (0.76µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HMTSW-208-09-T-D-540 Samtec Inc. HMTSW-208-09-T-D-540 -
RFQ
ECAD 3391 0.00000000 Samtec Inc. Flex Stack, HMTSW Bulk Active -55°C ~ 105°C - Through Hole - HMTSW-208 Solder - Board to Board or Cable download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 2 3A Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 16 0.100" (2.54mm) All Unshrouded Push-Pull 0.540" (13.72mm) 0.090" (2.29mm) 0.730" (18.54mm) 0.100" (2.54mm) Square Tin - Tin Liquid Crystal Polymer (LCP) Natural - - -
HMTSW-208-11-G-D-740 Samtec Inc. HMTSW-208-11-G-D-740 -
RFQ
ECAD 9247 0.00000000 Samtec Inc. Flex Stack, HMTSW Bulk Active -55°C ~ 125°C - Through Hole - HMTSW-208 Solder - Board to Board or Cable download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 2 3A Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 16 0.100" (2.54mm) All Unshrouded Push-Pull 0.740" (18.80mm) 0.090" (2.29mm) 0.930" (23.62mm) 0.100" (2.54mm) Square Gold 10.0µin (0.25µm) Gold Liquid Crystal Polymer (LCP) Natural - - 3.00µin (0.076µm)
HMTSW-208-11-G-Q-740 Samtec Inc. HMTSW-208-11-G-Q-740 -
RFQ
ECAD 4910 0.00000000 Samtec Inc. Flex Stack, HMTSW Bulk Active -55°C ~ 125°C - Through Hole - HMTSW-208 Solder - Board to Board or Cable download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 2 3A Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 16 0.200" (5.08mm) All Unshrouded Push-Pull 0.740" (18.80mm) 0.090" (2.29mm) 0.930" (23.62mm) 0.100" (2.54mm) Square Gold 10.0µin (0.25µm) Gold Liquid Crystal Polymer (LCP) Natural - - 3.00µin (0.076µm)
HMTSW-208-11-T-Q-740 Samtec Inc. HMTSW-208-11-T-Q-740 -
RFQ
ECAD 4266 0.00000000 Samtec Inc. Flex Stack, HMTSW Bulk Active -55°C ~ 105°C - Through Hole - HMTSW-208 Solder - Board to Board or Cable download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 2 3A Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 16 0.200" (5.08mm) All Unshrouded Push-Pull 0.740" (18.80mm) 0.090" (2.29mm) 0.930" (23.62mm) 0.100" (2.54mm) Square Tin - Tin Liquid Crystal Polymer (LCP) Natural - - -
HMTSW-208-13-S-Q-1040 Samtec Inc. HMTSW-208-13-S-Q-1040 -
RFQ
ECAD 7341 0.00000000 Samtec Inc. Flex Stack, HMTSW Bulk Active -55°C ~ 125°C - Through Hole - HMTSW-208 Solder - Board to Board or Cable download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 2 3A Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 16 0.200" (5.08mm) All Unshrouded Push-Pull 1.040" (26.42mm) 0.090" (2.29mm) 1.230" (31.24mm) 0.100" (2.54mm) Square Gold 30.0µin (0.76µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HMTSW-208-21-G-D-1240 Samtec Inc. HMTSW-208-21-G-D-1240 -
RFQ
ECAD 9491 0.00000000 Samtec Inc. Flex Stack, HMTSW Bulk Active -55°C ~ 125°C - Through Hole - HMTSW-208 Solder - Board to Board or Cable download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 2 3A Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 16 0.100" (2.54mm) All Unshrouded Push-Pull 1.240" (31.50mm) 0.090" (2.29mm) 1.430" (36.32mm) 0.100" (2.54mm) Square Gold 10.0µin (0.25µm) Gold Liquid Crystal Polymer (LCP) Natural - - 3.00µin (0.076µm)
HMTSW-208-21-S-D-1240 Samtec Inc. HMTSW-208-21-S-D-1240 -
RFQ
ECAD 4914 0.00000000 Samtec Inc. Flex Stack, HMTSW Bulk Active -55°C ~ 125°C - Through Hole - HMTSW-208 Solder - Board to Board or Cable download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 2 3A Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 16 0.100" (2.54mm) All Unshrouded Push-Pull 1.240" (31.50mm) 0.090" (2.29mm) 1.430" (36.32mm) 0.100" (2.54mm) Square Gold 30.0µin (0.76µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HMTSW-208-21-T-Q-1240 Samtec Inc. HMTSW-208-21-T-Q-1240 -
RFQ
ECAD 3183 0.00000000 Samtec Inc. Flex Stack, HMTSW Bulk Active -55°C ~ 105°C - Through Hole - HMTSW-208 Solder - Board to Board or Cable download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 2 3A Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 16 0.200" (5.08mm) All Unshrouded Push-Pull 1.240" (31.50mm) 0.090" (2.29mm) 1.430" (36.32mm) 0.100" (2.54mm) Square Tin - Tin Liquid Crystal Polymer (LCP) Natural - - -
HMTSW-208-22-G-D-440 Samtec Inc. HMTSW-208-22-G-D-440 -
RFQ
ECAD 4894 0.00000000 Samtec Inc. Flex Stack, HMTSW Bulk Active -55°C ~ 125°C - Through Hole - HMTSW-208 Solder - Board to Board or Cable download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 2 3A Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 16 0.100" (2.54mm) All Unshrouded Push-Pull 0.440" (11.17mm) 0.090" (2.29mm) 0.630" (16.00mm) 0.100" (2.54mm) Square Gold 10.0µin (0.25µm) Gold Liquid Crystal Polymer (LCP) Natural - - 3.00µin (0.076µm)
HMTSW-208-22-L-D-440 Samtec Inc. HMTSW-208-22-L-D-440 -
RFQ
ECAD 5915 0.00000000 Samtec Inc. Flex Stack, HMTSW Bulk Active -55°C ~ 125°C - Through Hole - HMTSW-208 Solder - Board to Board or Cable download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 2 3A Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 16 0.100" (2.54mm) All Unshrouded Push-Pull 0.440" (11.17mm) 0.090" (2.29mm) 0.630" (16.00mm) 0.100" (2.54mm) Square Gold 10.0µin (0.25µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HMTSW-208-23-L-D-255 Samtec Inc. HMTSW-208-23-L-D-255 -
RFQ
ECAD 1999 0.00000000 Samtec Inc. Flex Stack, HMTSW Bulk Active -55°C ~ 125°C - Through Hole - HMTSW-208 Solder - Board to Board or Cable download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 2 3A Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 16 0.100" (2.54mm) All Unshrouded Push-Pull 0.255" (6.48mm) 0.090" (2.29mm) 0.445" (11.30mm) 0.100" (2.54mm) Square Gold 10.0µin (0.25µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HMTSW-208-23-L-Q-255 Samtec Inc. HMTSW-208-23-L-Q-255 -
RFQ
ECAD 3237 0.00000000 Samtec Inc. Flex Stack, HMTSW Bulk Active -55°C ~ 125°C - Through Hole - HMTSW-208 Solder - Board to Board or Cable download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 2 3A Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 16 0.200" (5.08mm) All Unshrouded Push-Pull 0.255" (6.48mm) 0.090" (2.29mm) 0.445" (11.30mm) 0.100" (2.54mm) Square Gold 10.0µin (0.25µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HMTSW-208-27-G-Q-1140 Samtec Inc. HMTSW-208-27-G-Q-1140 -
RFQ
ECAD 8187 0.00000000 Samtec Inc. Flex Stack, HMTSW Bulk Active -55°C ~ 125°C - Through Hole - HMTSW-208 Solder - Board to Board or Cable download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 2 3A Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 16 0.200" (5.08mm) All Unshrouded Push-Pull 1.140" (28.96mm) 0.090" (2.29mm) 1.330" (33.78mm) 0.100" (2.54mm) Square Gold 10.0µin (0.25µm) Gold Liquid Crystal Polymer (LCP) Natural - - 3.00µin (0.076µm)
HMTSW-208-27-T-D-1140 Samtec Inc. HMTSW-208-27-T-D-1140 -
RFQ
ECAD 3717 0.00000000 Samtec Inc. Flex Stack, HMTSW Bulk Active -55°C ~ 105°C - Through Hole - HMTSW-208 Solder - Board to Board or Cable download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 2 3A Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 16 0.100" (2.54mm) All Unshrouded Push-Pull 1.140" (28.96mm) 0.090" (2.29mm) 1.330" (33.78mm) 0.100" (2.54mm) Square Tin - Tin Liquid Crystal Polymer (LCP) Natural - - -
HMTSW-209-06-T-T-110 Samtec Inc. HMTSW-209-06-T-T-110 -
RFQ
ECAD 7693 0.00000000 Samtec Inc. Flex Stack, HMTSW Bulk Active -55°C ~ 105°C - Through Hole - HMTSW-209 Solder - Board to Board or Cable download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 3 3A Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 27 0.100" (2.54mm) All Unshrouded Push-Pull 0.110" (2.79mm) 0.090" (2.29mm) 0.300" (7.62mm) 0.100" (2.54mm) Square Tin - Tin Liquid Crystal Polymer (LCP) Natural - - -
HMTSW-209-07-G-D-100-LA Samtec Inc. HMTSW-209-07-G-D-100-LA -
RFQ
ECAD 9070 0.00000000 Samtec Inc. Flex Stack, HMTSW Bulk Active -55°C ~ 125°C - Through Hole - HMTSW-209 Solder - Board to Board or Cable download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 2 3A Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 18 0.100" (2.54mm) All Unshrouded Push-Pull 0.100" (2.54mm) 0.230" (5.84mm) 0.430" (10.92mm) 0.100" (2.54mm) Square Gold 10.0µin (0.25µm) Gold Liquid Crystal Polymer (LCP) Natural - - 3.00µin (0.076µm)
HMTSW-209-07-G-D-100-RA Samtec Inc. HMTSW-209-07-G-D-100-RA -
RFQ
ECAD 5307 0.00000000 Samtec Inc. Flex Stack, HMTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HMTSW-209 Solder - Board to Board or Cable download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 2 3A Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 18 0.100" (2.54mm) All Unshrouded Push-Pull 0.100" (2.54mm) - - 0.240" (6.10mm) Square Gold 10.0µin (0.25µm) Gold Liquid Crystal Polymer (LCP) Natural - - 3.00µin (0.076µm)
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse