Rectangular Connectors(1164373)

Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Applications Mounting Type Features Base Product Number Accessory Type Color For Use With/Related Products Termination Ingress Protection Style DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Connector Type Pitch Number of Rows Row Spacing Current Rating (Amps) Contact Material Material Flammability Rating Contact Type Pitch - Mating Number of Positions Row Spacing - Mating Number of Positions Loaded Shrouding Fastening Type Contact Length - Mating Contact Length - Post Overall Contact Length Insulation Height Contact Shape Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Insulation Material Insulation Color Voltage Rating Mated Stacking Heights Contact Finish Thickness - Post Length - Overall Pin Length - Post (Mating) Length - Stack Height Length - Tail Contact Finish - Post (Mating) Contact Finish Thickness - Post (Mating)
HDWM-09-59-G-D-260-SM Samtec Inc. HDWM-09-59-G-D-260-SM -
RFQ
 ECAD 3114 0.00000000 Samtec Inc. Flex Stack, HDWM Bulk Active Surface Mount HDWM-09 Black Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 0.050" (1.27mm) 2 0.100" (2.54mm) 18 0.725" (18.415mm) 0.465" (11.811mm) 0.260" (6.604mm) - Gold 10.0µin (0.25µm)
HDWM-05-51-L-S-200 Samtec Inc. HDWM-05-51-L-S-200 -
RFQ
 ECAD 2818 0.00000000 Samtec Inc. Flex Stack, HDWM Bulk Active Through Hole HDWM-05 Black Solder - ROHS3 Compliant Not Applicable REACH Unaffected EAR99 8536.69.4040 1 0.050" (1.27mm) 1 - 5 0.410" (10.414mm) 0.090" (2.286mm) 0.200" (5.080mm) 0.120" (3.048mm) Gold 10.0µin (0.25µm)
TSW-131-16-G-T Samtec Inc. TSW-131-16-G-T 15.4400
RFQ
 ECAD 6328 0.00000000 Samtec Inc. TSW Bulk Active -55°C ~ 125°C - Through Hole - TSW-131 Solder - Board to Board or Cable - ROHS3 Compliant 1 (Unlimited) EAR99 8536.69.4040 1 Header 3 - Phosphor Bronze UL94 V-0 Male Pin 0.100" (2.54mm) 93 0.100" (2.54mm) All Unshrouded Push-Pull 0.320" (8.13mm) 0.310" (7.87mm) 0.730" (18.54mm) 0.100" (2.54mm) Square Gold 10.0µin (0.25µm) Gold Polybutylene Terephthalate (PBT) Black - - 3.00µin (0.076µm)
TW-04-06-G-D-360-120 Samtec Inc. TW-04-06-G-D-360-120 2.5800
RFQ
 ECAD 1680 0.00000000 Samtec Inc. TW Bulk Active Through Hole TW-04-06 Black Solder - ROHS3 Compliant 1 (Unlimited) EAR99 8536.69.4040 1 0.079" (2.00mm) 2 0.079" (2.00mm) 8 0.673" (17.094mm) 0.193" (4.900mm) 0.360" (9.144mm) 0.120" (3.048mm) Gold 20.0µin (0.51µm)
PBC33DGAN Sullins Connector Solutions PBC33DGAN 7.9700
RFQ
 ECAD 1501 0.00000000 Sullins Connector Solutions - Bulk Active -65°C ~ 125°C - Through Hole, Right Angle - PBC33 Solder - Board to Board or Cable download ROHS3 Compliant Not Applicable REACH Unaffected S2311E-33 EAR99 8536.69.4040 1 Header, Breakaway 2 3A Phosphor Bronze UL94 V-0 Male Pin 0.100" (2.54mm) 66 0.100" (2.54mm) All Unshrouded Push-Pull 0.318" (8.08mm) 0.100" (2.54mm) - 0.240" (6.10mm) Square Gold 10.0µin (0.25µm) Tin Polybutylene Terephthalate (PBT) Black - - 100.0µin (2.54µm)
HDWM-13-55-S-D-490-SM Samtec Inc. HDWM-13-55-S-D-490-SM -
RFQ
 ECAD 7642 0.00000000 Samtec Inc. Flex Stack, HDWM Bulk Active Surface Mount HDWM-13 Black Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 0.050" (1.27mm) 2 0.100" (2.54mm) 26 0.830" (21.082mm) 0.340" (8.636mm) 0.490" (12.446mm) - Gold 30.0µin (0.76µm)
GT32-19DP-SC Hirose Electric Co Ltd GT32-19DP-SC 0.8666
RFQ
 ECAD 1445 0.00000000 Hirose Electric Co Ltd GT32 Bulk Active - GT32 - GT32 Series - RoHS Compliant 1 (Unlimited) 782-0034-0-00 0000.00.0000 100 19
GBC02DABN-M30 Sullins Connector Solutions GBC02DABN-M30 0.4600
RFQ
 ECAD 7062 0.00000000 Sullins Connector Solutions - Bulk Active -65°C ~ 150°C - Surface Mount - GBC02D Solder - Board to Board or Cable download ROHS3 Compliant 1 (Unlimited) REACH Unaffected S2351E-02 EAR99 8536.69.4040 1 Header, Breakaway 2 3A Phosphor Bronze UL94 V-0 Male Pin 0.100" (2.54mm) 4 0.100" (2.54mm) All Unshrouded Push-Pull 0.230" (5.84mm) - - 0.100" (2.54mm) Square Gold 10.0µin (0.25µm) Tin Polyamide (PA9T), Nylon 9T Black - - 100.0µin (2.54µm)
TSW-132-11-L-D Samtec Inc. TSW-132-11-L-D 9.2200
RFQ
 ECAD 7919 0.00000000 Samtec Inc. TSW Bulk Active -55°C ~ 125°C - Through Hole - TSW-132 Solder - Board to Board or Cable - ROHS3 Compliant 1 (Unlimited) EAR99 8536.69.4040 1 Header 2 - Phosphor Bronze UL94 V-0 Male Pin 0.100" (2.54mm) 64 0.100" (2.54mm) All Unshrouded Push-Pull 0.230" (5.84mm) 0.600" (15.24mm) 0.930" (23.62mm) 0.100" (2.54mm) Square Gold 10.0µin (0.25µm) Tin Polybutylene Terephthalate (PBT) Black - - -
HDWM-35-54-S-D-200 Samtec Inc. HDWM-35-54-S-D-200 -
RFQ
 ECAD 3611 0.00000000 Samtec Inc. Flex Stack, HDWM Bulk Active Through Hole HDWM-35 Black Solder - ROHS3 Compliant Not Applicable REACH Unaffected EAR99 8536.69.4040 1 0.050" (1.27mm) 2 0.100" (2.54mm) 70 0.555" (14.097mm) 0.235" (5.969mm) 0.200" (5.080mm) 0.120" (3.048mm) Gold 30.0µin (0.76µm)
TW-03-05-G-D-260-210 Samtec Inc. TW-03-05-G-D-260-210 2.0200
RFQ
 ECAD 1134 0.00000000 Samtec Inc. TW Bulk Active Through Hole TW-03-05 Black Solder - ROHS3 Compliant 1 (Unlimited) EAR99 8536.69.4040 1 0.079" (2.00mm) 2 0.079" (2.00mm) 6 0.594" (15.088mm) 0.124" (3.150mm) 0.260" (6.604mm) 0.210" (5.334mm) Gold 20.0µin (0.51µm)
MTMM-150-10-G-S-248 Samtec Inc. MTMM-150-10-G-S-248 -
RFQ
 ECAD 5579 0.00000000 Samtec Inc. MTMM Bulk Active -55°C ~ 125°C - Through Hole - MTMM-150 Solder - Board to Board or Cable - ROHS3 Compliant 1 (Unlimited) EAR99 8536.69.4040 1 Header, Cuttable 1 3A Phosphor Bronze UL94 V-0 Male Pin 0.079" (2.00mm) 50 - All Unshrouded Push-Pull 0.248" (6.30mm) 0.555" (14.10mm) 0.059" (1.50mm) Square Gold 20.0µin (0.51µm) Gold Liquid Crystal Polymer (LCP) Black - - 3.00µin (0.076µm)
HDWM-16-59-S-D-200 Samtec Inc. HDWM-16-59-S-D-200 -
RFQ
 ECAD 3939 0.00000000 Samtec Inc. Flex Stack, HDWM Bulk Active Through Hole HDWM-16 Black Solder - ROHS3 Compliant Not Applicable REACH Unaffected EAR99 8536.69.4040 1 0.050" (1.27mm) 2 0.100" (2.54mm) 32 0.755" (19.177mm) 0.435" (11.049mm) 0.200" (5.080mm) 0.120" (3.048mm) Gold 30.0µin (0.76µm)
831-83-022-20-001101 Preci-Dip 831-83-022-20-001101 4.1678
RFQ
 ECAD 4589 0.00000000 Preci-Dip 831 Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - 831-83 Solder - Board to Board download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 190 Socket 1 3A Beryllium Copper UL94 V-0 Female Socket 0.079" (2.00mm) 22 - All Push-Pull 0.126" (3.20mm) 0.087" (2.20mm) Circular Gold 29.5µin (0.75µm) Tin Liquid Crystal Polymer (LCP), Glass Filled Black - - -
853-83-090-30-001101 Preci-Dip 853-83-090-30-001101 15.7000
RFQ
 ECAD 7196 0.00000000 Preci-Dip 853 Bulk Active -55°C ~ 125°C - Surface Mount - 853-83 Solder - Board to Board download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 40 Socket 2 1A Beryllium Copper UL94 V-0 Female Socket 0.050" (1.27mm) 90 0.050" (1.27mm) All Push-Pull - 0.203" (5.16mm) Circular Gold 29.5µin (0.75µm) Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Black - - -
XG4C-3431 Omron Electronics Inc-EMC Div XG4C-3431 2.5400
RFQ
 ECAD 9 0.00000000 Omron Electronics Inc-EMC Div XG4 Tray Active -55°C ~ 105°C - Through Hole Keying Slot XG4C Solder - Board to Board or Cable download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 60 Header 2 3A Brass, Nickel UL94 V-0 Male Pin 0.100" (2.54mm) 34 0.100" (2.54mm) All Shrouded - 4 Wall Push-Pull 0.240" (6.10mm) 0.126" (3.20mm) 0.480" (12.19mm) 0.335" (8.51mm) Square Gold 5.90µin (0.150µm) Tin Polybutylene Terephthalate (PBT), Glass Filled Black 300V 10.1mm, 19mm, 20.2mm 78.7µin (2.00µm)
850-80-042-10-001101 Preci-Dip 850-80-042-10-001101 5.9545
RFQ
 ECAD 9983 0.00000000 Preci-Dip 850 Bulk Active -55°C ~ 125°C - Through Hole - 850-80 Solder - Board to Board download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 120 Header 1 1A Brass UL94 V-0 Male Pin 0.050" (1.27mm) 42 - All Unshrouded Push-Pull 0.118" (3.00mm) 0.114" (2.90mm) 0.319" (8.10mm) 0.087" (2.20mm) Circular Tin - Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Black 150VDC - -
TW-04-03-L-D-240-135 Samtec Inc. TW-04-03-L-D-240-135 2.0200
RFQ
 ECAD 7723 0.00000000 Samtec Inc. TW Bulk Active Through Hole TW-04-03 Black Solder - ROHS3 Compliant 1 (Unlimited) EAR99 8536.69.4040 1 0.079" (2.00mm) 2 0.079" (2.00mm) 8 0.535" (13.589mm) 0.160" (4.064mm) 0.240" (6.096mm) 0.135" (3.429mm) Gold 10.0µin (0.25µm)
HDWM-39-53-L-S-250 Samtec Inc. HDWM-39-53-L-S-250 -
RFQ
 ECAD 2230 0.00000000 Samtec Inc. Flex Stack, HDWM Bulk Active Through Hole HDWM-39 Black Solder - ROHS3 Compliant Not Applicable REACH Unaffected EAR99 8536.69.4040 1 0.050" (1.27mm) 1 - 39 0.505" (12.827mm) 0.135" (3.429mm) 0.250" (6.350mm) 0.120" (3.048mm) Gold 10.0µin (0.25µm)
890-18-006-10-001101 Preci-Dip 890-18-006-10-001101 0.5006
RFQ
 ECAD 4031 0.00000000 Preci-Dip 890 Bulk Active -55°C ~ 125°C - Through Hole - 890-18 Solder - Board to Board download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1,500 Header 1 3A Brass UL94 V-0 Male Pin 0.100" (2.54mm) 6 - All Unshrouded Push-Pull 0.236" (6.00mm) 0.122" (3.10mm) 0.458" (11.64mm) 0.100" (2.54mm) Square Gold 10.0µin (0.25µm) Tin Polyamide (PA), Nylon, Glass Filled Black 150VDC - -
HDWM-18-53-S-D-355-SM Samtec Inc. HDWM-18-53-S-D-355-SM -
RFQ
 ECAD 2297 0.00000000 Samtec Inc. Flex Stack, HDWM Bulk Active Surface Mount HDWM-18 Black Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 0.050" (1.27mm) 2 0.100" (2.54mm) 36 0.590" (14.986mm) 0.235" (5.969mm) 0.355" (9.017mm) - Gold 30.0µin (0.76µm)
TSW-132-30-G-S Samtec Inc. TSW-132-30-G-S 6.4000
RFQ
 ECAD 3663 0.00000000 Samtec Inc. TSW Bulk Active -55°C ~ 125°C - Through Hole - TSW-132 Solder - Board to Board or Cable - ROHS3 Compliant 1 (Unlimited) EAR99 8536.69.4040 1 Header 1 - Phosphor Bronze UL94 V-0 Male Pin 0.100" (2.54mm) 32 - All Unshrouded Push-Pull 0.320" (8.13mm) 0.710" (18.03mm) 1.130" (28.70mm) 0.100" (2.54mm) Square Gold 10.0µin (0.25µm) Gold Polybutylene Terephthalate (PBT) Black - - 3.00µin (0.076µm)
TSW-123-22-G-D Samtec Inc. TSW-123-22-G-D 7.2200
RFQ
 ECAD 6544 0.00000000 Samtec Inc. TSW Bulk Active -55°C ~ 125°C - Through Hole - TSW-123 Solder - Board to Board or Cable - ROHS3 Compliant 1 (Unlimited) EAR99 8536.69.4040 1 Header 2 - Phosphor Bronze UL94 V-0 Male Pin 0.100" (2.54mm) 46 0.100" (2.54mm) All Unshrouded Push-Pull 0.230" (5.84mm) 0.300" (7.62mm) 0.630" (16.00mm) 0.100" (2.54mm) Square Gold 10.0µin (0.25µm) Gold Polybutylene Terephthalate (PBT) Black - - 3.00µin (0.076µm)
HDWM-30-59-S-D-280-SM Samtec Inc. HDWM-30-59-S-D-280-SM -
RFQ
 ECAD 1790 0.00000000 Samtec Inc. Flex Stack, HDWM Bulk Active Surface Mount HDWM-30 Black Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 0.050" (1.27mm) 2 0.100" (2.54mm) 60 0.745" (18.923mm) 0.465" (11.811mm) 0.280" (7.112mm) - Gold 30.0µin (0.76µm)
HDWM-10-56-L-S-250 Samtec Inc. HDWM-10-56-L-S-250 -
RFQ
 ECAD 8928 0.00000000 Samtec Inc. Flex Stack, HDWM Bulk Active Through Hole HDWM-10 Black Solder - ROHS3 Compliant Not Applicable REACH Unaffected EAR99 8536.69.4040 1 0.050" (1.27mm) 1 - 10 0.625" (15.875mm) 0.255" (6.477mm) 0.250" (6.350mm) 0.120" (3.048mm) Gold 10.0µin (0.25µm)
MTMM-106-05-TM-S-224 Samtec Inc. MTMM-106-05-TM-S-224 -
RFQ
 ECAD 9568 0.00000000 Samtec Inc. MTMM Bulk Active -55°C ~ 105°C - Through Hole - MTMM-106 Solder - Board to Board or Cable - ROHS3 Compliant 1 (Unlimited) EAR99 8536.69.4040 1 Header, Cuttable 1 3A Phosphor Bronze UL94 V-0 Male Pin 0.079" (2.00mm) 6 - All Unshrouded Push-Pull 0.224" (5.70mm) 0.377" (9.58mm) 0.059" (1.50mm) Square Tin - Tin Liquid Crystal Polymer (LCP) Black - - -
TW-03-09-G-S-200-095 Samtec Inc. TW-03-09-G-S-200-095 1.1700
RFQ
 ECAD 8518 0.00000000 Samtec Inc. TW Bulk Active Through Hole TW-03-09 Black Solder - ROHS3 Compliant 1 (Unlimited) EAR99 8536.69.4040 1 0.079" (2.00mm) 1 - 3 0.456" (11.582mm) 0.161" (4.089mm) 0.200" (5.080mm) 0.095" (2.413mm) Gold 20.0µin (0.51µm)
833-83-060-10-001101 Preci-Dip 833-83-060-10-001101 6.5043
RFQ
 ECAD 7292 0.00000000 Preci-Dip 833 Bulk Active -55°C ~ 125°C - Through Hole - 833-83 Solder - Board to Board download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 100 Socket 2 3A Beryllium Copper UL94 V-0 Female Socket 0.079" (2.00mm) 60 0.079" (2.00mm) All Push-Pull 0.125" (3.18mm) 0.165" (4.20mm) Circular Gold 29.5µin (0.75µm) Tin Liquid Crystal Polymer (LCP), Glass Filled Black - - -
GT28WS-2/2S-HU Hirose Electric Co Ltd GT28WS-2/2S-HU -
RFQ
 ECAD 7811 0.00000000 Hirose Electric Co Ltd * Bulk Active GT28 - RoHS Compliant Not Applicable 778-0009-4-00 EAR99 8538.90.6000 1
MTMM-150-06-G-D-068 Samtec Inc. MTMM-150-06-G-D-068 -
RFQ
 ECAD 1706 0.00000000 Samtec Inc. MTMM Bulk Active -55°C ~ 125°C - Through Hole - MTMM-150 Solder - Board to Board or Cable - ROHS3 Compliant 1 (Unlimited) EAR99 8536.69.4040 1 Header, Cuttable 2 3A Phosphor Bronze UL94 V-0 Male Pin 0.079" (2.00mm) 100 0.079" (2.00mm) All Unshrouded Push-Pull 0.068" (1.73mm) 0.397" (10.08mm) 0.059" (1.50mm) Square Gold 20.0µin (0.51µm) Gold Liquid Crystal Polymer (LCP) Black - - 3.00µin (0.076µm)
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse

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AD9208BBPZ-3000

196-LFBGA Exposed Pad

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