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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Applications Mounting Type Features Base Product Number Termination Ingress Protection Style RoHS Status Moisture Sensitivity Level (MSL) ECCN HTSUS Standard Package Connector Type Number of Rows Current Rating (Amps) Contact Material Material Flammability Rating Contact Type Pitch - Mating Number of Positions Row Spacing - Mating Number of Positions Loaded Shrouding Fastening Type Contact Length - Mating Contact Length - Post Overall Contact Length Insulation Height Contact Shape Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Insulation Material Insulation Color Voltage Rating Mated Stacking Heights Contact Finish Thickness - Post
HTSW-219-08-L-D-LA Samtec Inc. HTSW-219-08-L-D-LA -
RFQ
ECAD 3718 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-219 Kinked Pin, Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 2 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 38 0.100" (2.54mm) All Unshrouded Push-Pull 0.230" (5.84mm) 0.090" (2.29mm) - 0.240" (6.10mm) Square Gold 10.0µin (0.25µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-219-08-L-Q-LA Samtec Inc. HTSW-219-08-L-Q-LA -
RFQ
ECAD 3136 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-219 Kinked Pin, Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 3 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 57 0.100" (2.54mm) 38 Unshrouded Push-Pull 0.230" (5.84mm) 0.090" (2.29mm) - 0.320" (8.13mm) Square Gold 10.0µin (0.25µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-219-08-L-Q-RA Samtec Inc. HTSW-219-08-L-Q-RA -
RFQ
ECAD 6885 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-219 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 3 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 57 0.100" (2.54mm) 38 Unshrouded Push-Pull 0.230" (5.84mm) 0.090" (2.29mm) - 0.320" (8.13mm) Square Gold 10.0µin (0.25µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-219-08-S-D-LA Samtec Inc. HTSW-219-08-S-D-LA -
RFQ
ECAD 2823 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-219 Kinked Pin, Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 2 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 38 0.100" (2.54mm) All Unshrouded Push-Pull 0.230" (5.84mm) 0.090" (2.29mm) - 0.240" (6.10mm) Square Gold 30.0µin (0.76µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-219-08-S-D-RA Samtec Inc. HTSW-219-08-S-D-RA -
RFQ
ECAD 1899 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-219 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 2 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 38 0.100" (2.54mm) All Unshrouded Push-Pull 0.230" (5.84mm) 0.090" (2.29mm) - 0.240" (6.10mm) Square Gold 30.0µin (0.76µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-219-08-S-Q-RA Samtec Inc. HTSW-219-08-S-Q-RA -
RFQ
ECAD 1435 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-219 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 3 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 57 0.100" (2.54mm) 38 Unshrouded Push-Pull 0.230" (5.84mm) 0.090" (2.29mm) - 0.320" (8.13mm) Square Gold 30.0µin (0.76µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-219-08-T-Q-LA Samtec Inc. HTSW-219-08-T-Q-LA -
RFQ
ECAD 3223 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 105°C - Through Hole, Right Angle - HTSW-219 Kinked Pin, Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 3 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 57 0.100" (2.54mm) 38 Unshrouded Push-Pull 0.230" (5.84mm) 0.090" (2.29mm) - 0.320" (8.13mm) Square Tin - Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-219-09-F-D-LA Samtec Inc. HTSW-219-09-F-D-LA -
RFQ
ECAD 3983 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-219 Kinked Pin, Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 2 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 38 0.100" (2.54mm) All Unshrouded Push-Pull 0.230" (5.84mm) 0.290" (7.37mm) - 0.240" (6.10mm) Square Gold 3.00µin (0.076µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-219-09-G-D-LA Samtec Inc. HTSW-219-09-G-D-LA -
RFQ
ECAD 7659 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-219 Kinked Pin, Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 2 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 38 0.100" (2.54mm) All Unshrouded Push-Pull 0.230" (5.84mm) 0.290" (7.37mm) - 0.240" (6.10mm) Square Gold 10.0µin (0.25µm) Gold Liquid Crystal Polymer (LCP) Natural - - 3.00µin (0.076µm)
HTSW-219-09-T-Q-RA Samtec Inc. HTSW-219-09-T-Q-RA -
RFQ
ECAD 7169 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 105°C - Through Hole, Right Angle - HTSW-219 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 3 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 57 0.100" (2.54mm) 38 Unshrouded Push-Pull 0.230" (5.84mm) 0.290" (7.37mm) - 0.320" (8.13mm) Square Tin - Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-219-10-L-Q-RA Samtec Inc. HTSW-219-10-L-Q-RA -
RFQ
ECAD 5197 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-219 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 3 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 57 0.100" (2.54mm) 38 Unshrouded Push-Pull 0.230" (5.84mm) 0.390" (9.91mm) - 0.320" (8.13mm) Square Gold 10.0µin (0.25µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-219-10-S-D-RA Samtec Inc. HTSW-219-10-S-D-RA -
RFQ
ECAD 8074 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-219 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 2 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 38 0.100" (2.54mm) All Unshrouded Push-Pull 0.230" (5.84mm) 0.390" (9.91mm) - 0.240" (6.10mm) Square Gold 30.0µin (0.76µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-219-10-S-Q-RA Samtec Inc. HTSW-219-10-S-Q-RA -
RFQ
ECAD 4422 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-219 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 3 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 57 0.100" (2.54mm) 38 Unshrouded Push-Pull 0.230" (5.84mm) 0.390" (9.91mm) - 0.320" (8.13mm) Square Gold 30.0µin (0.76µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-219-10-T-Q-RA Samtec Inc. HTSW-219-10-T-Q-RA -
RFQ
ECAD 8745 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 105°C - Through Hole, Right Angle - HTSW-219 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 3 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 57 0.100" (2.54mm) 38 Unshrouded Push-Pull 0.230" (5.84mm) 0.390" (9.91mm) - 0.320" (8.13mm) Square Tin - Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-219-11-F-D-RA Samtec Inc. HTSW-219-11-F-D-RA -
RFQ
ECAD 8308 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-219 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 2 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 38 0.100" (2.54mm) All Unshrouded Push-Pull 0.230" (5.84mm) 0.490" (12.45mm) - 0.240" (6.10mm) Square Gold 3.00µin (0.076µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-219-11-G-D-RA Samtec Inc. HTSW-219-11-G-D-RA -
RFQ
ECAD 4291 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-219 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 2 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 38 0.100" (2.54mm) All Unshrouded Push-Pull 0.230" (5.84mm) 0.490" (12.45mm) - 0.240" (6.10mm) Square Gold 10.0µin (0.25µm) Gold Liquid Crystal Polymer (LCP) Natural - - 3.00µin (0.076µm)
HTSW-219-11-S-Q-RA Samtec Inc. HTSW-219-11-S-Q-RA -
RFQ
ECAD 4014 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-219 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 3 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 57 0.100" (2.54mm) 38 Unshrouded Push-Pull 0.230" (5.84mm) 0.490" (12.45mm) - 0.320" (8.13mm) Square Gold 30.0µin (0.76µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-219-11-T-D-RA Samtec Inc. HTSW-219-11-T-D-RA -
RFQ
ECAD 7115 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 105°C - Through Hole, Right Angle - HTSW-219 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 2 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 38 0.100" (2.54mm) All Unshrouded Push-Pull 0.230" (5.84mm) 0.490" (12.45mm) - 0.240" (6.10mm) Square Tin - Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-219-12-G-Q-RA Samtec Inc. HTSW-219-12-G-Q-RA -
RFQ
ECAD 4549 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-219 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 3 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 57 0.100" (2.54mm) 38 Unshrouded Push-Pull 0.230" (5.84mm) 0.590" (14.99mm) - 0.320" (8.13mm) Square Gold 10.0µin (0.25µm) Gold Liquid Crystal Polymer (LCP) Natural - - 3.00µin (0.076µm)
HTSW-219-12-L-D-RA Samtec Inc. HTSW-219-12-L-D-RA -
RFQ
ECAD 3051 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-219 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 2 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 38 0.100" (2.54mm) All Unshrouded Push-Pull 0.230" (5.84mm) 0.590" (14.99mm) - 0.240" (6.10mm) Square Gold 10.0µin (0.25µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-219-12-S-D-RA Samtec Inc. HTSW-219-12-S-D-RA -
RFQ
ECAD 5819 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-219 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 2 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 38 0.100" (2.54mm) All Unshrouded Push-Pull 0.230" (5.84mm) 0.590" (14.99mm) - 0.240" (6.10mm) Square Gold 30.0µin (0.76µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-219-12-S-Q-RA Samtec Inc. HTSW-219-12-S-Q-RA -
RFQ
ECAD 6005 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-219 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 3 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 57 0.100" (2.54mm) 38 Unshrouded Push-Pull 0.230" (5.84mm) 0.590" (14.99mm) - 0.320" (8.13mm) Square Gold 30.0µin (0.76µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-219-13-L-D-RA Samtec Inc. HTSW-219-13-L-D-RA -
RFQ
ECAD 1432 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-219 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 2 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 38 0.100" (2.54mm) All Unshrouded Push-Pull 0.230" (5.84mm) 0.790" (20.07mm) - 0.240" (6.10mm) Square Gold 10.0µin (0.25µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-219-16-F-D-LA Samtec Inc. HTSW-219-16-F-D-LA -
RFQ
ECAD 3201 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-219 Kinked Pin, Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 2 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 38 0.100" (2.54mm) All Unshrouded Push-Pull 0.320" (8.13mm) 0.200" (5.08mm) - 0.240" (6.10mm) Square Gold 3.00µin (0.076µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-219-16-F-Q-RA Samtec Inc. HTSW-219-16-F-Q-RA -
RFQ
ECAD 3413 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-219 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 3 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 57 0.100" (2.54mm) 38 Unshrouded Push-Pull 0.320" (8.13mm) 0.200" (5.08mm) - 0.320" (8.13mm) Square Gold 3.00µin (0.076µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-219-16-G-D-RA Samtec Inc. HTSW-219-16-G-D-RA -
RFQ
ECAD 5201 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-219 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 2 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 38 0.100" (2.54mm) All Unshrouded Push-Pull 0.320" (8.13mm) 0.200" (5.08mm) - 0.240" (6.10mm) Square Gold 10.0µin (0.25µm) Gold Liquid Crystal Polymer (LCP) Natural - - 3.00µin (0.076µm)
HTSW-219-16-L-D-RA Samtec Inc. HTSW-219-16-L-D-RA -
RFQ
ECAD 1141 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-219 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 2 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 38 0.100" (2.54mm) All Unshrouded Push-Pull 0.320" (8.13mm) 0.200" (5.08mm) - 0.240" (6.10mm) Square Gold 10.0µin (0.25µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-219-16-T-D-RA Samtec Inc. HTSW-219-16-T-D-RA -
RFQ
ECAD 2654 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 105°C - Through Hole, Right Angle - HTSW-219 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 2 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 38 0.100" (2.54mm) All Unshrouded Push-Pull 0.320" (8.13mm) 0.200" (5.08mm) - 0.240" (6.10mm) Square Tin - Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-219-16-T-Q-LA Samtec Inc. HTSW-219-16-T-Q-LA -
RFQ
ECAD 9828 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 105°C - Through Hole, Right Angle - HTSW-219 Kinked Pin, Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 3 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 57 0.100" (2.54mm) 38 Unshrouded Push-Pull 0.320" (8.13mm) 0.200" (5.08mm) - 0.320" (8.13mm) Square Tin - Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-219-21-L-Q-RA Samtec Inc. HTSW-219-21-L-Q-RA -
RFQ
ECAD 2735 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-219 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 3 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 57 0.100" (2.54mm) 38 Unshrouded Push-Pull 0.230" (5.84mm) 0.990" (25.15mm) - 0.320" (8.13mm) Square Gold 10.0µin (0.25µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse